Patents by Inventor Philip BEUCLER

Philip BEUCLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency connector and assembly having micro-via radial interconnect
    Patent number: 9761972
    Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: September 12, 2017
    Assignee: MERCURY SYSTEMS, INC.
    Inventors: Philip Beucler, Daniel Coolidge, Darryl J. McKenney, Kevin Jorczak
  • RADIO FREQUENCY CONNECTOR AND ASSEMBLY HAVING MICRO-VIA RADIAL INTERCONNECT
    Publication number: 20170149156
    Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.
    Type: Application
    Filed: July 1, 2016
    Publication date: May 25, 2017
    Inventors: Philip BEUCLER, Daniel COOLIDGE, Darryl J. MCKENNEY, Kevin JORCZAK