Patents by Inventor Philip CELAYA

Philip CELAYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Half-bridge HEMT circuit and an electronic package including the circuit
    Patent number: 9773895
    Abstract: A half-bridge circuit can include a high-side HEMT, a high-side switch transistor, a low-side HEMT, and a low-side switch transistor. The die substrates of the HEMTs can be coupled to the sources of their corresponding switch transistors. In another aspect, a packaged electronic device for a half-bridge circuit can have a design that can use shorter connectors that help to reduce parasitic inductance and resistance. In a further aspect, a packaged electronic device for a half-bridge circuit can include more than one connection along the bottom of the package allows less lead connections along the periphery of the packaged electronic device and can allow for a smaller package.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: September 26, 2017
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Balaji Padmanabhan, Prasad Venkatraman, Peter Moens, Mihir Mudholkar, Joe Fulton, Philip Celaya, Stephen St. Germain, Chun-Li Liu, Jason McDonald, Alexander Young, Ali Salih
  • HALF-BRIDGE HEMT CIRCUIT AND AN ELECTRONIC PACKAGE INCLUDING THE CIRCUIT
    Publication number: 20160322969
    Abstract: A half-bridge circuit can include a high-side HEMT, a high-side switch transistor, a low-side HEMT, and a low-side switch transistor. The die substrates of the HEMTs can be coupled to the sources of their corresponding switch transistors. In another aspect, a packaged electronic device for a half-bridge circuit can have a design that can use shorter connectors that help to reduce parasitic inductance and resistance. In a further aspect, a packaged electronic device for a half-bridge circuit can include more than one connection along the bottom of the package allows less lead connections along the periphery of the packaged electronic device and can allow for a smaller package.
    Type: Application
    Filed: April 20, 2016
    Publication date: November 3, 2016
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Balaji PADMANABHAN, Prasad VENKATRAMAN, Peter MOENS, Mihir MUDHOLKAR, Joe FULTON, Philip CELAYA, Stephen ST. GERMAIN, Chun-Li LIU, Jason MCDONALD, Alexander YOUNG, Ali SALIH