Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.

Abstract: Embodiments disclosed herein include a semiconductor processing tool. In an embodiment, the semiconductor processing tool comprises a chamber, and a lid configured to seal the chamber. In an embodiment, a modular microwave plasma applicator is provided through the lid, and an optical port is provided through the lid and adjacent to the modular microwave plasma source. In an embodiment, a pin is inserted in the optical port.

Abstract: The invention relates to a breathing assistance apparatus that may be configured to reduce the risk of damage to electronics within the apparatus as a result of liquid leaks within the apparatus or impacts to the apparatus. In other forms, the apparatus may be configured to allow for easy assembly and/or safe operation.

Abstract: Exemplary methods of etching a silicon-containing material may include flowing a first fluorine-containing precursor into a remote plasma region of a semiconductor processing chamber. The methods may include flowing a sulfur-containing precursor into the remote plasma region of the semiconductor processing chamber. The methods may include forming a plasma within the remote plasma region to generate plasma effluents of the first fluorine-containing precursor and the sulfur-containing precursor. The methods may include flowing the plasma effluents into a processing region of the semiconductor processing chamber. A substrate may be positioned within the processing region. The substrate may include a trench formed through stacked layers including alternating layers of silicon nitride and silicon oxide. The methods may include isotropically etching the layers of silicon nitride while substantially maintaining the silicon oxide.

Abstract: Embodiments includes methods for forming a silicon nitride film on a substrate in a deposition chamber. In embodiments, the substrate is sequentially exposed to a sequence of processing gases, comprising: a silicon halide precursor that absorbs onto a surface of the substrate to form an absorbed layer of the silicon halide, a first reacting gas that includes N2 and one or both of Ar and He, and a second reacting gas comprising a hydrogen-containing gas and one or more of Ar, He, and N2. In embodiments, the hydrogen-containing gas includes at least one of H2 (molecular hydrogen), NH3 (ammonia), N2H2 (diazene), N2H4 (hydrazine), and HN3 (hydrogen azide). Embodiments may include repeating the sequence until a desired thickness of the silicon nitride film is obtained.

Abstract: A vehicle and components thereof are provided. The vehicle can include an apparatus having a shelving module, a post, and a mechanism.

Abstract: A vehicle and components thereof are provided. The vehicle can include an apparatus having a shelving module, a post, and a mechanism.

Abstract: A vehicle and components thereof are provided. The vehicle can include an apparatus having a shelving module, a post, and a mechanism.

Abstract: An apparatus for compressing food includes a receptacle for receiving the food, a lever coupled to the receptacle, a piston, and a rack-and-pinion assembly coupled to the lever and to the piston such that actuation of the lever is converted by the rack-and-pinion assembly into movement of the piston into and out of the receptacle.

Abstract: An apparatus for compressing food comprises a receptacle for receiving the food, a lever coupled to the receptacle, a piston, and a rack-and-pinion assembly coupled to the lever and to the piston such that actuation of the lever is converted by the rack-and-pinion assembly into movement of the piston into and out of the receptacle.

Abstract: In a computer system having a CPU and a graphics subsystem, a device for dynamic graphics subsystem clock adjustment. A clock pulse generator is used for generating a clock frequency. The clock frequency is coupled to the graphics subsystem and is used by the graphics subsystem to synchronize and pace its internal operations. The clock frequency generated by the generator is variable over a range. A controller is coupled to the clock pulse generator, for adjusting the clock frequency from the clock pulse generator over the range. The controller interfaces with the computer system through an interface coupled to the controller. Through the interface, the controller communicates with the computer system or graphics subsystem and determines a load placed on the graphics subsystem.