Patents by Inventor Philip Chung-Hwei Chen

Philip Chung-Hwei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-melting-temperatue tin and plating process
    Publication number: 20040089556
    Abstract: In the low-lead-content plating process of the present invention, tens to hundreds ppms of lead, thallium and iron ions, which are much lower than the international “non-lead” standard, are added into a pure tin plating liquid to change the crystal phase orientation during infrared-ray reflow, thereby reducing the melting point of the plated layer.
    Type: Application
    Filed: October 31, 2003
    Publication date: May 13, 2004
    Inventor: Philip Chung-Hwei Chen
  • Low-lead-content plating process
    Publication number: 20030089617
    Abstract: In the low-lead-content plating process of the present invention, tens to hundreds ppms of lead, thallium and iron ions, which are much lower than the international “non-lead” standard, are added into a pure tin plating liquid to change the crystal phase orientation during infrared-ray reflow, thereby reducing the melting point of the plated layer.
    Type: Application
    Filed: December 28, 2001
    Publication date: May 15, 2003
    Inventor: Philip Chung-Hwei Chen