Patents by Inventor Philip E. Crabtree

Philip E. Crabtree has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a die with recessed aluminum die pads
    Patent number: 9209078
    Abstract: A method for making a semiconductor device comprises forming an electrical interconnect layer, forming a first dielectric layer over the interconnect layer, forming an opening in the first dielectric layer over a first electrical interconnect of the interconnect layer, forming an aluminum layer over the first dielectric layer, etching the aluminum layer to form an aluminum die pad, forming a second dielectric layer over the aluminum die pad and the first dielectric layer, and forming a conductive via through the first and second dielectric layers to contact a second electrical interconnect of the interconnect layer.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: December 8, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Gregory S. Spencer, Philip E. Crabtree, Dean J. Denning, Kurt H. Junker, Gerald A. Martin
  • METHOD OF MAKING A DIE WITH RECESSED ALUMINUM DIE PADS
    Publication number: 20140213050
    Abstract: A method for making a semiconductor device comprises forming an electrical interconnect layer, forming a first dielectric layer over the interconnect layer, forming an opening in the first dielectric layer over a first electrical interconnect of the interconnect layer, forming an aluminum layer over the first dielectric layer, etching the aluminum layer to form an aluminum die pad, forming a second dielectric layer over the aluminum die pad and the first dielectric layer, and forming a conductive via through the first and second dielectric layers to contact a second electrical interconnect of the interconnect layer.
    Type: Application
    Filed: March 31, 2014
    Publication date: July 31, 2014
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: GREGORY S. SPENCER, Philip E. Crabtree, Dean J. Denning, Kurt H. Junker, Gerald A. Martin