Patents by Inventor Philip E. Heil

Philip E. Heil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capped magnetic memory
    Patent number: 10256395
    Abstract: An embodiment includes an apparatus comprising: a magnetic tunnel junction (MTJ), between first and second electrodes, comprising a dielectric layer between fixed and free layers; a dielectric film directly contacting sidewalls of the first electrode; and a metallic layer coupled to the sidewalls via the dielectric film; wherein (a) a vertical axis intersects the first and second electrodes and the MTJ but not the metallic layer, (b) a first horizontal axis intersects the metallic layer, the dielectric film, and the first electrode; and (c) a second horizontal axis, between the first horizontal axis and the MTJ, intersects the dielectric film and the first electrode but not the capping layer. Other embodiments are described herein.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: April 9, 2019
    Assignee: Intel Corporation
    Inventors: Daniel R. Lamborn, Oleg Golonzka, Christopher J. Wiegand, Philip E. Heil, M D Tofizur Rahman, Rebecca J. Castellano, Tarun Bansal
  • CAPPED MAGNETIC MEMORY
    Publication number: 20180182952
    Abstract: An embodiment includes an apparatus comprising: a magnetic tunnel junction (MTJ), between first and second electrodes, comprising a dielectric layer between fixed and free layers; a dielectric film directly contacting sidewalls of the first electrode; and a metallic layer coupled to the side-walls via the dielectric film; wherein (a) a vertical axis intersects the first and second electrodes and the MTJ but not the metallic layer, (b) a first horizontal axis intersects the metallic layer, the dielectric film, and the first electrode; and (c) a second horizontal axis, between the first horizontal axis and the MTJ, intersects the dielectric film and the first electrode but not the capping layer. Other embodiments are described herein.
    Type: Application
    Filed: June 19, 2015
    Publication date: June 28, 2018
    Inventors: Daniel R. Lamborn, Oleg Golonzka, Christopher J. Wiegand, Philip E. Heil, MD Tofizur Rahman, Rebecca J. Castellano, Tarun Bansal