Patents by Inventor Philip E. Humphrey

Philip E. Humphrey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for testing adhesive bonds
    Patent number: 5176028
    Abstract: An adhesive is applied to overlapping portions of a two-part test sample located between opposing press heads of the bond testing device. The press heads then press together the overlapping portions for a specific period of time while heating the test sample to a preselected temperature. The device precisely maintains the temperature while bonding the sample at a preselected pressure. A load cell measures the shear force required to separate the bonded test piece.
    Type: Grant
    Filed: October 1, 1990
    Date of Patent: January 5, 1993
    Assignee: The State of Oregon acting by and through the Oregon State Board of Higher Education on behalf of Oregon State University
    Inventor: Philip E. Humphrey