Abstract: A monolithic ceramic electrochemical cell housing is provided. The housing includes two or more electrochemical sub cell housings. Each of the electrochemical sub cell housing includes an anode receptive space, a cathode receptive space, a separator between the anode receptive space and the cathode receptive space, and integrated electron conductive circuits. A first integrated electron conductive circuit is configured as an anode current collector within the anode receptive space. A second integrated electron conductive circuit is disposed as a cathode current collector within the cathode receptive space.

Abstract: A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone.

Abstract: A hybrid electrochemical cell is provided. The cell includes two or more electrochemical sub-cells. Each of the electrochemical sub-cells includes an anode receptive space, a cathode receptive space, a separator between the anode receptive space and a cathode receptive space. Any of the materials that are not required to support ion transfer may be replaced with another material engineered to be compatible with the chemistry, sintering properties and mechanical properties of the ceramic electrolyte material. The material is selected to be less expensive and less reactive with the environment than the ceramic electrolyte material.

Abstract: An electrophotographic three dimensional printer system, including at least one electrophotographic (EP) printing module employing multi-material EP printing technology. The printer system may also include one or more additional printer modules employing different patterning and deposition technology, such as powder bed and jetted binder technology. The EP printing module may be used to create a 3D object derived from a composite toner material that may comprise an engineering material treated with a triboelectric material. The composite toner material may be designed to undergo a post printing treatment wherein a triboelectric material may be separated from an engineering material and the engineering material may undergo a change.

Abstract: A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone.

Abstract: A monolithic ceramic electrochemical cell housing is provided. The housing includes two or more electrochemical sub cell housings. Each of the electrochemical sub cell housing includes an anode receptive space, a cathode receptive space, a separator between the anode receptive space and the cathode receptive space, and integrated electron conductive circuits. A first integrated electron conductive circuit is configured as an anode current collector within the anode receptive space. A second integrated electron conductive circuit is disposed as a cathode current collector within the cathode receptive space.

Abstract: A ceramic lithium battery sub-cell is provided. The ceramic lithium battery sub-cell includes a cathode region, an anode region, and a separator interconnecting the cathode region and the anode region. The separator is a ceramic electrolyte free of penetrating apertures. The ceramic lithium battery sub-cell also includes a cathode current collector positioned on a surface of the cathode region, and an anode current collector positioned on a surface of the anode region. The anode region is filled with a first porous electrolyte encapsulated by the separator, the anode current collector and at its periphery by a second porous electrolyte. The porosity of the second porous electrolyte is less than the porosity of the first porous electrolyte.

Abstract: A monolithic ceramic electrochemical cell housing is provided. The housing includes two or more electrochemical sub cell housings. Each of the electrochemical sub cell housing includes an anode receptive space, a cathode receptive space, a separator between the anode receptive space and the cathode receptive space, and integrated electron conductive circuits. A first integrated electron conductive circuit is configured as an anode current collector within the anode receptive space. A second integrated electron conductive circuit is disposed as a cathode current collector within the cathode receptive space.

Abstract: A multi-material three-dimensional printing apparatus is provided. The provided apparatus includes two or more print stations. Each of the print stations includes a substrate, a transportation device, a dispersion device, a compaction device, a printing device, a fixing device, and a fluidized materials removal device. The apparatus also includes an assembly apparatus in communication with the two or more print stations via the transportation device. The apparatus also includes one or more transfer devices in communication with the assembly apparatus. The apparatus also includes a computing and controlling device configured to control the operations of the two or more print stations, the assembly apparatus and the one or more transfer devices.

Abstract: A monolithic ceramic electrochemical cell housing is provided. The housing includes two or more electrochemical sub cell housings. Each of the electrochemical sub cell housing includes an anode receptive space, a cathode receptive space, a separator between the anode receptive space and the cathode receptive space, and integrated electron conductive circuits. A first integrated electron conductive circuit is configured as an anode current collector within the anode receptive space. A second integrated electron conductive circuit is disposed as a cathode current collector within the cathode receptive space.

Abstract: A ceramic lithium battery sub-cell is provided. The ceramic lithium battery sub-cell includes a cathode region, an anode region, and a separator interconnecting the cathode region and the anode region. The separator is a ceramic electrolyte free of penetrating apertures. The ceramic lithium battery sub-cell also includes a cathode current collector positioned on a surface of the cathode region, and an anode current collector positioned on a surface of the anode region. The anode region is filled with a first porous electrolyte encapsulated by the separator, the anode current collector and at its periphery by a second porous electrolyte. The porosity of the second porous electrolyte is less than the porosity of the first porous electrolyte.

Abstract: A lead carrier includes a temporary support layer, member, medium, or carrier upon which are dispersed a plurality of package sites, organized in a predetermined pattern such as a matrix or array. Each package site within a continuous sheet of mold compound of the lead carrier includes a semiconductor die; a set of terminal structures, each having a top side and an opposing back side that is exposed at a back side of the continuous sheet of mold compound; and a set of electrical current path redistribution structures, each formed as an elongate wiring structure having a first end, a second end distinct from the first end, a top surface, an opposing bottom surface, a width, and a thickness between its top and bottom surfaces. Each redistribution structure as-fabricated is either electrically pre-coupled to a predetermined terminal structure, or electrically isolated from each terminal structure.

Abstract: A lead carrier includes a continuous sheet of mold compound having a top side and an opposing back side, and forms an array of package sites corresponding to semiconductor packages. Each package site when fabricated includes a semiconductor die having a top side, and an opposing treated base exposed at the back side of the continuous sheet of mold compound; a set of terminal pads, each having a top side and an opposing back side exposed at the back side of the continuous sheet of mold compound; a plurality of wire bonds formed between a set of input/output junctions on the top side of the semiconductor die and the top side of each terminal pad; and hardened mold compound encapsulating the semiconductor die, the set of terminal pads, and the plurality of wire bonds. Each package site excludes a die attach pad to which the semiconductor die is fixed.

Abstract: A solid state electrochemical cell structure includes at least one integrated anode—current collector structure having a counterpart integrated cathode—current collector structure separated by an electrolyte layer. An integrated anode or cathode—current collector structure can be fabricated as a generally planar or planar layer structure having a surface area greater or much greater than its thickness, and which carries anode or cathode material composition, respectively, in which a current collector layer is enveloped, embedded, or encased; or a porous 3D mesh current collector structure in which an anode material composition or cathode material composition, respectively is enveloped, embedded, or encased by way of residing within a void volume fraction of the 3D mesh current collector structure. Integrated anode-current collector structures, cathode-current collector structures, and electrolyte layers can be fabricated by way of an additive manufacturing process (e.g., 3D printing).

Abstract: A layer of a first powder is dispensed in a layer over a build plate. Binder is then selectively applied to hold portions of the layer of first powder together. Unbound first powder is then removed. A second powder is then dispensed in a layer over the build plate and portions of the bound first powder above the build plate. Binder is then selectively applied to hold portions of the second powder together. Unbound second powder is then removed. A third or more different powders can be similarly dispensed and bound to complete a multi-material layer. The process is then be repeated on a next subsequent layer. A curing radiation source can accelerate binding of powder together. Voids can be formed in portions of the layers by dispensing a fugitive material in portions of each multi-material layer. Mechanisms for implementing the printing process are also disclosed.

Abstract: A lead carrier provides support for an integrated circuit chip and associated leads during manufacture as packages containing such chips. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a plurality of terminal pads surrounding a die attach region. The pads are formed of sintered electrically conductive material. A chip is placed at the die attach region and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronic system board. Edges of the pads are contoured to cause the pads to engage with the mold compound to securely hold the pads within the package.

Abstract: A layer of a first powder is dispensed in a layer over a build plate. Binder is then selectively applied to hold portions of the layer of first powder together. Unbound first powder is then removed. A second powder is then dispensed in a layer over the build plate and portions of the bound first powder above the build plate. Binder is then selectively applied to hold portions of the second powder together. Unbound second powder is then removed. A third or more different powders can be similarly dispensed and bound to complete a multi-material layer. The process is then be repeated on a next subsequent layer. A curing radiation source can accelerate binding of powder together. Voids can be formed in portions of the layers by dispensing a fugitive material in portions of each multi-material layer. Mechanisms for implementing the printing process are also disclosed.

Abstract: A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a die attach pad surrounded by a plurality of terminal pads. The pads are formed of a fusible fixing material on a lower portion. A chip is mounted upon the die attach pad and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be heated above a melting temperature of the fusible fixing material and peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronics system board.

Abstract: A lead carrier provides support for an integrated circuit chip and associated leads during manufacture as packages containing such chips. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a die attach pad surrounded by a plurality of terminal pads. The pads are formed of a sintered electrically conductive material. A chip is mounted upon the die attach pad and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronics system board. Edges of the pads are contoured to cause the pads to engage with the mold compound to securely hold the pads within the package.

Abstract: A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each site includes a die attach pad surrounded by terminal pads. The pads are formed of multiple materials including a lower layer and a body portion. An upper layer can also be provided over the body portion. A chip is mounted upon the die pad and wire bonds extend from the chip to the terminal pads. These parts are all encapsulated within a mold compound. The body portion is preferably formed by providing a matrix of metal powder and a suspension medium at locations where the pads are to be located. Heat is applied to disperse the suspension medium and sinter the metal powder to form the body portion. After encapsulation the temporary support member can be peeled away and the package sites isolated from each other.