Patents by Inventor Philip Earle Clark

Philip Earle Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cable-to-board arrangements for enhanced RF shielding
    Patent number: 6004145
    Abstract: A cable-to-board arrangement configured to nondetachably couple wires of a cable to surface-mounted pads on a circuit board. The cable-to-board arrangement includes a first nonconductive housing and a flexible board having thereon a plurality of conductive traces. The conductive traces have first ends and second ends opposite the first ends with the first ends being electrically coupled to the wires. The first nonconductive housing encapsulates a first portion of the flexible board including the first ends. The cable-to-board arrangement further includes a plurality of conductive legs configured for coupling with the surface-mounted pads on the board. The plurality of conductive legs are electrically coupled to the second ends of the conductive traces. There is also included a second nonconductive housing encapsulating a second portion of the flexible board including the second ends of the conductive traces and a portion of the conductive legs.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: December 21, 1999
    Assignees: DiCon (S) PTE Ltd., DiCON Connectors, Inc., Focus Enhancements, Inc.
    Inventors: Steven Paul Gasparovic, Lee Hock Eng, Ng Lea Swee, Philip Earle Clark, Ronald K. Anderson, Alan Scott Gibbons