Patents by Inventor Philip Ebeling

Philip Ebeling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7531122
    Abstract: An apparatus and method for bonding polymeric materials is provided. The apparatus and method both utilize ferromagnetic materials in association with the polymeric materials to be bonded together. The polymeric materials, and the ferromagnetic material, are placed within a magnetic field, which causes hysterisis losses in the magnetic field, and thus elevation in the temperature of both the ferromagnetic material and the polymeric materials to the point where the polymeric materials melt and fuse together. The ferromagnetic materials only rise in temperature to their Curie temperatures, at which point the hysterisis losses cease, and the polymeric material stops being heated. Removing the electromagnetic field allows for cooling and fusing. An interface composition may also be placed between the two polymeric materials to be bonded.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: May 12, 2009
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Jan Weber, Philip Ebeling
  • Publication number: 20040021249
    Abstract: An apparatus and method for bonding polymeric materials is disclosed. The apparatus and method both utilize ferromagnetic materials in association with the polymeric materials to be bonded together. The polymeric materials, and the ferromagnetic material, are placed within a magnetic field, which causes hysterisis losses in the magnetic field, and thus elevation in the temperature of both the ferromagnetic material and the polymeric materials to the point where the polymeric materials melt and fuse together. The ferromagnetic materials only rise in temperature to their Curie temperatures, at which point the hysterisis losses cease, and the polymeric material stops being heated. Removing the electromagnetic field allows for cooling and fusing. An interface composition may also be placed between the two polymeric materials to be bonded.
    Type: Application
    Filed: March 28, 2003
    Publication date: February 5, 2004
    Inventors: Jan Weber, Philip Ebeling