Abstract: An electroactive lens, method, and pair of glasses are described. The electroactive lens forms a stack of at least three elements. A first transparent body is a first lens element having a first optical axis. A second transparent body is a second lens element having a second optical axis. At least one lens foil sandwiched between the first and second transparent body comprises a first and second transparent electrode, and a Fresnel lens and liquid crystalline material therebetween to define an optical device. The first and second transparent electrodes are electrically coupled to terminals and are configured to receive a voltage for operating the switchable lens. First and second conductive plug are positioned relative to the optical axis of the Fresnel lens such that radial lines extending from the optical axis to the first and second conductive plugs mutually enclose an angle of less than 120, 90, or 60 degrees.

Abstract: The present disclosure relates to a connector suitable for providing an electronic connection between a control unit and at least one electro-optical component arranged in an electroactive lens for electronic glasses, wherein the electroactive lens has a circumferential rim along which a plurality of exposed contact areas are arranged providing electrical contact with the electro-optical component, the connector comprising a flexible cable connected to the control unit and comprising connection portions to connect to a compressible connector module, a compressible connector module, positioned between the circumferential rim of the lens and the flexible cable and configured to provide an electrical connection between the exposed contact areas and the connection portions, wherein the compressible connector module is configured to be compressed between the lens and the frame, and a sealing unit configured to enclose at least the conductive connection portions of the flexible cable and the compressible connector

Abstract: An optical device (3) comprising a light transmitting electrode layer (2) provided onto a light transmitting carrier (15), wherein a conductive layer (6) is provided on the first electrode layer (2), the conductive layer establishing a connecting area (4), the conductive layer having a thickness being significantly larger than the thickness of the electrode layer (2), and wherein the electrode layer (2) and carrier (15) show a perforation in the connecting area, the perforation being at least partially filled with a conductive material (7) which is further connected to a conductive element (1) thereby establishing an electrical connection between the electrode layer (2) and the conductive element (1) via the conductive layer (6) and the conductive material.

Abstract: Example embodiments relate to methods of integrating an electronic device into an eyeglass frame, and electronic glasses. One example set of electronic glasses is configured to be provided with at least one electro-optical component formed by an electro-active lens. The electronic glasses include an eyeglass frame that includes a first temple and a second temple, which include a first front temple part and a second front temple part, respectively. The electronic glasses also include a front part. The front part includes a left eyepiece for a left electro-active lens, a right eyepiece for a right electro-active lens, a bridge connecting the left and right eyepieces, and a groove. In addition, the electronic glasses include an electronic device. The electronic glasses further include a flexible cable arranged in the groove. Additionally, the electronic glasses include closure measures that include a sealing element.

Abstract: The present disclosure relates to an electroactive lens a method of producing the same and a pair of glasses comprising at least one electroactive lens, the electroactive lens forming a stack of at least three elements, wherein: a first transparent body is a first lens element having a first optical axis, a second transparent body is a second lens element having a second optical axis; at least one lens foil sandwiched between the first transparent body and the second transparent body comprises a first transparent electrode, a second transparent electrode, and a Fresnel lens and liquid crystalline material therebetween to defining an optical device, wherein the first and second transparent electrodes are electrically coupled to terminals and are configured to receive a voltage for operating the switchable lens, wherein the first and second conductive plug are positioned relative to the optical axis of the Fresnel lens such that radial lines extending from the optical axis of the Fresnel lens to the first and s

Abstract: An optical device (3) comprising a light transmitting electrode layer (2) provided onto a light transmitting carrier (15), wherein a conductive layer (6) is provided on the first electrode layer (2), the conductive layer establishing a connecting area (4), the conductive layer having a thickness being significantly larger than the thickness of the electrode layer (2), and wherein the electrode layer (2) and carrier (15) show a perforation in the connecting area, the perforation being at least partially filled with a conductive material (7) which is further connected to a conductive element (1) thereby establishing an electrical connection between the electrode layer (2) and the conductive element (1) via the conductive layer (6) and the conductive material.

Abstract: A method for bonding thin chips to a target substrate is described herein. According to an example method, an adhesive tape is provided with thinned chips attached thereto. The chips are transferred to a carrier substrate by one or more tape-to-tape transfer steps. The carrier is then diced into separate carrier-and-chip assemblies, which can be handled by existing tools designed for handling chips of regular thickness. The fact that the thinning step is separate from the carrier attachment may lead to reduced thickness variation of the chips. The use of tape-to-tape transfer steps allows for attaching either the front or the back side of the chips to the carrier. The use of an individual carrier per chip allows for treating the thinned chip as if it were a standard chip.

Abstract: A method for bonding thin chips to a target substrate is described herein. According to an example method, an adhesive tape is provided with thinned chips attached thereto. The chips are transferred to a carrier substrate by one or more tape-to-tape transfer steps. The carrier is then diced into separate carrier-and-chip assemblies, which can be handled by existing tools designed for handling chips of regular thickness. The fact that the thinning step is separate from the carrier attachment may lead to reduced thickness variation of the chips. The use of tape-to-tape transfer steps allows for attaching either the front or the back side of the chips to the carrier. The use of an individual carrier per chip allows for treating the thinned chip as if it were a standard chip.