Abstract: A membrane-actuated charge controlled mirror (CCM) that exhibits increased deflection range, reduced beam current and improved electrostatic stability is fabricated using a combination of flat panel manufacturing along with traditional MEMS techniques. More specifically, a unique combination of five masking layers is used to fabricate a number of CCMs on a large glass panel. At the completion of the MEMS processing, the glass panel is diced into individual CCMs. Thereafter, the polymer mirror and membrane release layers are simultaneously released through vent holes in the membrane to leave the free-standing CCM.

Abstract: An improved liquid crystal display cell (34) comprising two substrates (108, 124) spaced apart and containing a quantity of liquid crystal mixture (18) therebetween, in which the substrates have facing surfaces (108', 124') coated with a continuous, electrically conducting material (38, 36), is provided with an array of spacer pads (40) at a pre-selected distance apart from each other, having a pre-selected height to maintain a given spacing between the substrates, and having a pre-selected cross-section that avoids substantial interference with the display properties of the liquid crystal display cell.

Abstract: A method for producing optically flat thin semiconductor wafers (12) bonded to a substrate (16). The wafer (12) is bonded without touching the top surface of the wafer (12). Also, the bond is created without the use of pressure. Electrostatic bonding, or contact bonding or both may be employed. After the wafer (12) is bonded, it is then polished to a desired thickness and flatness. After contact bonding and polishing the wafer (12) may then be removed for further processing. The wafer may then be contact bonded to a final substrate (b 34) or electrostatically bonded to a final substrate (42). The contact bonding technique may also be employed as a means for holding the wafer (12) during precise photolithography. The optical flatness achieved permits improved yields over conventional means for securing wafers during photolithography. The electrostatic bonding technique permits extremely thin optically flat silicon wafers to be produced.

Abstract: An electron beam addressed liquid crystal light valve (LCLV) produces an AC voltage across a liquid crystal layer from a single polarity electron beam, and exhibits very high resolution. A thin layer of partially conductive material is deposited on a support membrane on the electron beam side of the liquid crystal. A conductive, electron beam permeable sheet is formed on the back of the partially conductive layer. Electrons from the beam are absorbed by the partially conductive layer, and then flow back out to the conductive sheet to produce an AC voltage prior to the next electron beam scan. The conductive sheet is connected in circuit with a transparent electrode which provides a voltage reference on the readout side of the liquid crystal. The device is designed with electrical parameters that produce a discharge rate from the partially conductive layer fast enough to complete an AC cycle between successive electron beam scans, but slow enough for the liquid crystal to respond and produce an image.

Abstract: A process of preparing a nickel secondary electron emissive conductive cong along the interior channel walls of a microchannel plate or by continuing the process of preparing a solid nickel conductor channel to provide a conductive panel and the apparatuses resulting therefrom. The microchannel plate is positioned in a heated oven, or deposition chamber, such that heated inert gases are forced through the open channels to stabilize the channel temperature. The temperature is then lowered and a nickel compound gas is mixed with the inert gas. The gas mixture is forced through the channels to decompose the microchannel plate material and deposit a thin nickel coating on the interior channel walls. If a conductive panel is desired, the process is continued until the entire channel is completely filled with nickel.