Patents by Inventor Philip G. Umberger

Philip G. Umberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8876110
    Abstract: One embodiment of a credential manufacturing device comprises a first hopper, a first processing path, a first processing device, a substrate shuttle and a shuttle drive. The first hopper is configured to contain a plurality of card substrates and includes an output port. The first processing device is in the first processing path and is configured to perform a first process on individual card substrates in the first processing path. The substrate shuttle is positioned between the first hopper and the first processing path and is configured to receive individual card substrates from the output port of the first hopper, transport received card substrates along a shuttle path, and deliver received card substrates to the first processing path. The shuttle drive is configured to drive movement of the substrate shuttle along the shuttle path.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: November 4, 2014
    Assignee: Assa Abloy AB
    Inventors: Ted M. Hoffman, Philip G. Umberger
  • Publication number: 20130121793
    Abstract: One embodiment of a credential manufacturing device comprises a first hopper, a first processing path, a first processing device, a substrate shuttle and a shuttle drive. The first hopper is configured to contain a plurality of card substrates and includes an output port. The first processing device is in the first processing path and is configured to perform a first process on individual card substrates in the first processing path. The substrate shuttle is positioned between the first hopper and the first processing path and is configured to receive individual card substrates from the output port of the first hopper, transport received card substrates along a shuttle path, and deliver received card substrates to the first processing path. The shuttle drive is configured to drive movement of the substrate shuttle along the shuttle path.
    Type: Application
    Filed: November 10, 2011
    Publication date: May 16, 2013
    Applicant: HID Global Corporation
    Inventors: Ted M. Hoffman, Philip G. Umberger
  • Patent number: 6639808
    Abstract: A card guide system is provided. The card guide system comprises a chassis having a top and a bottom frame portion. The top and bottom frame portions each include a plurality of card guide members disposed thereon. The card guide members of the top frame portion are a mirror image of the card guide members of the bottom frame portion. In addition, the plurality of card guide members are adapted to receive a circuit card and secure the circuit card using tension, wherein when the circuit is received by the card guide members the circuit card is bowed.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: October 28, 2003
    Assignee: ADC Telecommunications, Inc.
    Inventor: Philip G. Umberger