Abstract: An inductive sensor device includes a reference sensor head that is used to adjust the characteristics of an operational sensor head that is used to detect movement of a conductive target. The reference sensor head has near it a fixed reference target that is similar to the target for which the operational sensor head detects movement, with the difference that the reference target is fixed with respect to a reference sensor coil of the reference sensor head. The reference sensor head includes a variable reference capacitor or variable reference inductor that is adjusted to maintain constant (or nearly constant) output, such as a constant (or nearly constant) resonant frequency, during operation of the sensor device. Adjustments of the variable reference element (variable capacitor or variable inductor) may be undertaken to compensate for changes in characteristics of the reference sensor due to changes in temperature, for example.

Abstract: A position sensor device includes a sensor head with a sensor coil, and an analog-to-digital (A/D) converter for digitizing output from the sensor coil, and sending the digital input to electronics of the device for further processing. The A/D converter is located closer to the coil than it is to the electronics, which may be in an electronics box mounted remotely from the sensor head. The A/D converter may be a part of the sensor head, may be adjacent to the sensor head, and/or may be connected to the sensor coil by an analog output cable. The analog output cable between the sensor coil and the A/D converter may be of negligible length (and of negligible capacitance), and in any event may be shorter than a digital output cable between the A/D converter and the electronics.

Abstract: A position sensor device includes a sensor head with a sensor coil, and an analog-to-digital (A/D) converter for digitizing output from the sensor coil, and sending the digital input to electronics of the device for further processing. The A/D converter is located closer to the coil than it is to the electronics, which may be in an electronics box mounted remotely from the sensor head. The A/D converter may be a part of the sensor head, may be adjacent to the sensor head, and/or may be connected to the sensor coil by an analog output cable. The analog output cable between the sensor coil and the A/D converter may be of negligible length (and of negligible capacitance), and in any event may be shorter than a digital output cable between the A/D converter and the electronics.

Abstract: An inductive sensor device includes a reference sensor head that is used to adjust the characteristics of an operational sensor head that is used to detect movement of a conductive target. The reference sensor head has near it a fixed reference target that is similar to the target for which the operational sensor head detects movement, with the difference that the reference target is fixed with respect to a reference sensor coil of the reference sensor head. The reference sensor head includes a variable reference capacitor or variable reference inductor that is adjusted to maintain constant (or nearly constant) output, such as a constant (or nearly constant) resonant frequency, during operation of the sensor device. Adjustments of the variable reference element (variable capacitor or variable inductor) may be undertaken to compensate for changes in characteristics of the reference sensor due to changes in temperature, for example.

Abstract: Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector.

Abstract: Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector.