Patents by Inventor Philip Hammar

Philip Hammar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and plasma ashing process for increasing photoresist removal rate
    Patent number: 7449416
    Abstract: A plasma ashing process for removing photoresist material and post etch residues from a substrate comprising carbon, hydrogen, or a combination of carbon and hydrogen, wherein the substrate comprises a low k dielectric layer, the process comprising forming a plasma from an essentially oxygen free and nitrogen free gas mixture; introducing the plasma into a process chamber, wherein the process chamber comprises a baffle plate assembly in fluid communication with the plasma; flowing the plasma through the baffle plate assembly and removing photoresist material, post etch residues, and volatile byproducts from the substrate; periodically cleaning the process chamber by introducing an oxygen plasma into the process chamber; and cooling the baffle plate assembly by flowing a cooling gas over the baffle plate assembly.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: November 11, 2008
    Assignee: Axcelis Technologies, Inc.
    Inventors: Alan F. Becknell, Philip Hammar, David Ferris
  • Apparatus and plasma ashing process for increasing photoresist removal rate
    Publication number: 20060046470
    Abstract: A plasma ashing process for removing photoresist material and post etch residues from a substrate comprising carbon, hydrogen, or a combination of carbon and hydrogen, wherein the substrate comprises a low k dielectric layer, the process comprising forming a plasma from an essentially oxygen free and nitrogen free gas mixture; introducing the plasma into a process chamber, wherein the process chamber comprises a baffle plate assembly in fluid communication with the plasma; flowing the plasma through the baffle plate assembly and removing photoresist material, post etch residues, and volatile byproducts from the substrate; periodically cleaning the process chamber by introducing an oxygen plasma into the process chamber; and cooling the baffle plate assembly by flowing a cooling gas over the baffle plate assembly.
    Type: Application
    Filed: September 1, 2005
    Publication date: March 2, 2006
    Inventors: Alan Becknell, Philip Hammar, David Ferris