Patents by Inventor Philip Heidelberg

Philip Heidelberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040103218
    Abstract: A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System-On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node may be used individually or simultaneously to work on any combination of computation or communication as required by the particular algorithm being solved or executed at any point in time. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency.
    Type: Application
    Filed: August 22, 2003
    Publication date: May 27, 2004
    Inventors: Matthias A Blumrich, Dong Chen, George L Chiu, Thomas M Cipolla, Paul W Coteus, Alan G Gara, Mark E Giampapa, Philip Heidelberg, Gerard V Kopcsay, Lawrence S Mok, Todd E Takken