Abstract: An optical fiber cable connector assembly comprising two connectors each of which is comprised of a rigid inorganic body which is coated with an organic layer into which grooves are formed which are adapted to restrain the ends of two fiber optic cables. One connector is adapted to fit over the other when inverted to form the assembly with one or more fiber optic cables restrained between them.

Abstract: The invention is a sol-gel extrusion process which allows fabrication of both thick and thin wall tubes. For example, the process is capable of preparing silica overcladding tubes in a manner easier than sol-gel casting processes, and also capable of preparing relatively thin substrate tubes, which are difficult to cast. According to the invention, a silica dispersion containing a stabilizing agent is provided, a gelling agent is added to the dispersion to induce gellation, and the resultant gel is extruded into a silica body, in the substantial absence of polymeric material from the gel. Substantially avoiding the inclusion of such polymeric material in overcladding and substrate tubes offers significant commercial advantages by reducing the time and energy required to remove organic materials from the tube bodies, by reducing environmental impact, and by reducing the amount of impurities introduced in the tubes.

Abstract: A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade of polymer used to fabricate the body portion. The body portion has top and bottom openings adapted to receive the top and bottom cap portions. The network interface electrical components are enclosed within the housing.

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production.

Abstract: Various methods have been proposed for measuring the viscosity of thermosetting polymers. It has been found that these method are generally inaccurate. A test which avoids the inaccuracies of previous techniques is proposed. In this test the heated thermosetting resin is forced at a known flow rate through a runner and through a capillary tube at the end of the runner. By measuring the pressure differential across the capillary a meaningful measure of viscosity is obtained.