Abstract: A programmatic arbitrary distribution of items in a modeling system may be provided. To perform the distribution, a surface may be received, and a point count of application points associated with locations on the surface may be determined. A density map may be applied over the surface to assign a density to portions of the surface for the point count. Application points are then assigned to locations on the surface according to the density map and a scattering function of the point count, where the scattering function is based on one or more repulsion forces between neighboring points. The one or more repulsion forces are treated as pushing each of the neighboring point apart. Thereafter, the surface may be provided having the application points scattered across the surface based on the one or more repulsion forces.

Abstract: A programmatic arbitrary distribution of items in a modeling system may be provided. To perform the distribution, a surface may be received, and a point count of application points associated with locations on the surface may be determined. A density map may be applied over the surface to assign a density to portions of the surface for the point count. Application points are then assigned to locations on the surface according to the density map and a scattering function of the point count, where the scattering function is based on one or more repulsion forces between neighboring points. The one or more repulsion forces are treated as pushing each of the neighboring point apart. Thereafter, the surface may be provided having the application points scattered across the surface based on the one or more repulsion forces.

Abstract: A programmatic arbitrary distribution of items in a modeling system may be provided. To perform the distribution, a surface may be received, and a point count of application points associated with locations on the surface may be determined. A density map may be applied over the surface to assign a density to portions of the surface for the point count. Application points are then assigned to locations on the surface according to the density map and a scattering function of the point count, where the scattering function is based on one or more repulsion forces between neighboring points. The one or more repulsion forces are treated as pushing each of the neighboring point apart. Thereafter, the surface may be provided having the application points scattered across the surface based on the one or more repulsion forces.

Abstract: A programmatic arbitrary distribution of items in a modeling system may be provided. To perform the distribution, a surface may be received, and a point count of application points associated with locations on the surface may be determined. A density map may be applied over the surface to assign a density to portions of the surface for the point count. Application points are then assigned to locations on the surface according to the density map and a scattering function of the point count, where the scattering function is based on one or more repulsion forces between neighboring points. The one or more repulsion forces are treated as pushing each of the neighboring point apart. Thereafter, the surface may be provided having the application points scattered across the surface based on the one or more repulsion forces.

Abstract: An inventory tracking system and method for use in semiconductor manufacturing provide for generating a priority score that determines the order in which lots of substrates should be run. The priority score is generated using an algorithm that takes into account external lot priority considerations, inventory factors in the manufacturing facility, and processing tool capability factors. The processing tool capability factors include factors related to tool status and tool restrictions and the inventory factors include factors related to line balance, WIP (work-in-progress) forecasts and various downstream considerations. The priority score is generated dynamically and displayed at each processing operation for each lot that is queued for processing at the indicated operation. Various algorithms are used and different weights are assigned to many factors in calculating numerical values for several factors that combine to produce the priority score.

Abstract: An inventory tracking system and method for use in semiconductor manufacturing provide for generating a priority score that determines the order in which lots of substrates should be run. The priority score is generated using an algorithm that takes into account external lot priority considerations, inventory factors in the manufacturing facility, and processing tool capability factors. The processing tool capability factors include factors related to tool status and tool restrictions and the inventory factors include factors related to line balance, WIP (work-in-progress) forecasts and various downstream considerations. The priority score is generated dynamically and displayed at each processing operation for each lot that is queued for processing at the indicated operation. Various algorithms are used and different weights are assigned to many factors in calculating numerical values for several factors that combine to produce the priority score.