Patents by Inventor Philip J. DePond

Philip J. DePond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11938536
    Abstract: Metal powder particles for use in additive manufacturing are made by removing material from the surface of the particles using wet chemical etching to create a nanoscale texturing of the surface, increasing absorptivity by the metal powder particles of incident laser light and maintaining flowability. The nanoscale texturing has sub-wavelength features at laser wavelengths in the range 800-1100 nm. The particles are substantially spherical and have mean diameters in the range 10-70 ?m.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: March 26, 2024
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Ottman A. Tertuliano, Philip J. DePond, Andrew Curtis Lee, Xun Gu, Wei Cai, Adrian J. Lew
  • Publication number: 20220305553
    Abstract: Metal powder particles for use in additive manufacturing are made by removing material from the surface of the particles using wet chemical etching to create a nanoscale texturing of the surface, increasing absorptivity by the metal powder particles of incident laser light and maintaining flowability. The nanoscale texturing has sub-wavelength features at laser wavelengths in the range 800-1100 nm. The particles are substantially spherical and have mean diameters in the range 10-70 ?m.
    Type: Application
    Filed: March 28, 2022
    Publication date: September 29, 2022
    Inventors: Ottman A. Tertuliano, Philip J. DePond, Andrew Curtis Lee, Xun Gu, Wei Cai, Adrian J. Lew