Patents by Inventor Philip J. Procter

Philip J. Procter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulating electronic components
    Patent number: 5158735
    Abstract: Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25.times.10.sup.-4 cal/cm-sec-.degree.C.) and improved stress characteristics (e.g., a thermal shock cycle number of at least 30).
    Type: Grant
    Filed: May 20, 1991
    Date of Patent: October 27, 1992
    Assignee: The Dexter Corporation
    Inventor: Philip J. Procter
  • Encapsulating electronic components
    Patent number: 4826896
    Abstract: Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25.times.10.sup.-4 cal/cm-sec-.degree.C.) and improved stress characteristics (e.g. a thermal shock cycle number of at least 30).
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: May 2, 1989
    Assignee: The Dexter Corporation
    Inventor: Philip J. Procter