Abstract: A frame lit mirror component includes an extruded frame member. The extruded frame member further includes a mirror mounting edge. The mirror mounting edge extends along a longitudinal direction of the extruded frame member. The mirror mounting edge is sized to receive an edge of a mirror. A light source volume extends along the longitudinal direction of the extruded frame member. An angle exists between the mirror mounting edge and the light source volume. The light source volume is sized to receive a light source, such that when the light source is in an on-state light radiates from the light source volume.

Abstract: A frame lit mirror component includes an extruded frame member. The extruded frame member further includes a mirror mounting edge. The mirror mounting edge extends along a longitudinal direction of the extruded frame member. The mirror mounting edge is sized to receive an edge of a mirror. A light source volume extends along the longitudinal direction of the extruded frame member. An angle exists between the mirror mounting edge and the light source volume. The light source volume is sized to receive a light source, such that when the light source is in an on-state light radiates from the light source volume.

Abstract: A deposition system is disclosed that allows for growth of inclined c-axis piezoelectric material structures. The system integrates various sputtering modules to yield high quality films and is designed to optimize throughput lending it to a high-volume in manufacturing environment. The system includes two or more process modules including an off-axis module constructed to deposit material at an inclined c-axis and a longitudinal module constructed to deposit material at normal incidence; a central wafer transfer unit including a load lock, a vacuum chamber, and a robot disposed within the vacuum chamber and constructed to transfer a wafer substrate between the central wafer transfer unit and the two or more process modules; and a control unit operatively connected to the robot.

Abstract: An apparatus to provide a source of light includes a lighted mirror. The lighted mirror is configured for installation within a building. A single electrical power circuit provides a source of electrical power to the lighted mirror from the building. The single electrical power circuit is either in an ON state or an OFF state. The lighted mirror includes a nightlight system. The nightlight system includes a battery. The battery is electrically connected to charge when the single electrical circuit is in the ON state. The nightlight system includes a first sensor. The first sensor is configured to receive electrical power from the battery and to measure a first value for a first parameter from an area proximate to the lighted mirror. The nightlight system includes a nightlight. The nightlight is electrically connected to receive electrical power from the battery. The nightlight system has an ON state and an OFF state and control logic.

Abstract: Extruded frame members are connected together to create a frame around a mirror that be illuminated from in front of the mirror. The extruded frame members contain various components in channels or cavities. An extruded frame member can have a channel that contains a light source. A diffuser can be secured over the light source. Another channel is used to hold a mirror in place. The front lit mirror can be hung on a wall utilizing a channel in an extruded frame member. The extruded frame members contain electrical components and mechanical hardware. The hardware is used to attach a plurality of extruded frame members together and to attach an optional decorative frame to an extruded frame member. An extruded frame member is made from transparent or translucent material and can radiate light from a light source contained therein. An extruded frame member is opaque and cannot radiate light.

Abstract: A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.

Abstract: A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.

Abstract: A method of recycling radio frequency printed circuit boards comprising track material printed on a laminate having a known dielectric constant using the steps of separating the substrate of one or more circuit boards from the track material; and processing the separated material to form a thin layer of substrate material suitable for relaminating with track material to provide a product for use in the manufacture of a further radio frequency printed circuit board. The method may separate the material from the laminate by grinding or use of an etchant.

Abstract: A method of recycling radio frequency printed circuit boards comprising track material printed on a laminate having a known dielectric constant using the steps of separating the substrate of one or more circuit boards from the track material; and processing the separated material to form a thin layer of substrate material suitable for relaminating with track material to provide a product for use in the manufacture of a further radio frequency printed circuit board. The method may separate the material from the laminate by grinding or use of an etchant.