Patents by Inventor Philip Kulse

Philip Kulse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10832953
    Abstract: Method for producing a semiconductor device by providing a silicon wafer having a plurality of equal height raised portions on a first surface thereof; depositing an etch stop layer on the first surface; planarizing a surface of the etch stop layer; permanently bonding a first carrier wafer on the etch stop layer surface; producing components on or in a second wafer surface in a FEOL process; etching a plurality of trenches into the wafer, each trench formed at the respective location of one of the raised portions; depositing side wall insulation layers on side walls of the trenches; forming through-silicon vias by filling the trenches with electrically conductive material; producing a conductor path stack in a BEOL process for contacting the active components on the second surface; temporarily bonding a second carrier wafer onto a surface of the conductor path stack; removing the first carrier wafer and exposing the vias.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: November 10, 2020
    Assignee: IHP GMBH—INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK
    Inventors: Matthias Wietstruck, Mehmet Kaynak, Philip Kulse, Marco Lisker, Steffen Marschmeyer, Dirk Wolansky
  • Publication number: 20180286751
    Abstract: Method for producing a semiconductor device by providing a silicon wafer having a plurality of equal height raised portions on a first surface thereof; depositing an etch stop layer on the first surface; planarizing a surface of the etch stop layer; permanently bonding a first carrier wafer on the etch stop layer surface; producing components on or in a second wafer surface in a FEOL process; etching a plurality of trenches into the wafer, each trench formed at the respective location of one of the raised portions; depositing side wall insulation layers on side walls of the trenches; forming through-silicon vias by filling the trenches with electrically conductive material; producing a conductor path stack in a BEOL process for contacting the active components on the second surface; temporarily bonding a second carrier wafer onto a surface of the conductor path stack; removing the first carrier wafer and exposing the vias.
    Type: Application
    Filed: September 28, 2017
    Publication date: October 4, 2018
    Inventors: Matthias Wietstruck, Mehmet Kaynak, Philip Kulse, Marco Lisker, Steffen Marschmeyer, Dirk Wolansky
  • Patent number: 9638617
    Abstract: Micro-electromechanical device for measuring the viscosity of a fluid, comprises a measuring chamber with a micromechanical actuator, arranged as a cantilever above a metallically conductive counter electrode, elastically deformable towards the counter electrode, surrounded by the fluid to be measured and made of a metallically conductive material, a two-terminal RF voltage source that can be switched off, having a first output terminal connected to the actuator, and a second output terminal connected to the counter electrode, and which is designed to output an RF voltage signal that is suitable for deflecting the actuator out of its rest position, and a measuring device to detect a change in the frequency, amplitude or phase of the RF signal in order to determine a measurement value for the viscosity-dependent speed at which the actuator is deformed.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: May 2, 2017
    Assignee: IHP GMBH—INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK
    Inventors: Mario Birkholz, Jurgen Drews, Karl-Ernst Ehwald, Dieter Genschow, Ulrich Haak, Philip Kulse, Egbert Matthus, Katrin Schulz, Wolfgang Winkler, Dirk Wolansky, Marlen Frohlich
  • Publication number: 20140000344
    Abstract: Micro-electromechanical device for measuring the viscosity of a fluid, comprises a measuring chamber with a micromechanical actuator, arranged as a cantilever above a metallically conductive counter electrode, elastically deformable towards the counter electrode, surrounded by the fluid to be measured and made of a metallically conductive material, a two-terminal RF voltage source that can be switched off, having a first output terminal connected to the actuator, and a second output terminal connected to the counter electrode, and which is designed to output an RF voltage signal that is suitable for deflecting the actuator out of its rest position, and a measuring device to detect a change in the frequency, amplitude or phase of the RF signal in order to determine a measurement value for the viscosity-dependent speed at which the actuator is deformed.
    Type: Application
    Filed: June 19, 2013
    Publication date: January 2, 2014
    Inventors: Mario Birkholz, Jurgen Drews, Karl-Ernst Ehwald, Dieter Genschow, Ulrich Haak, Philip Kulse, Egbert Matthus, Katrin Schulz, Wolfgang Winkler, Dirk Wolansky, Marlen Frohlich