Abstract: Esterification and transesterification methods, systems and apparatus are disclosed which increase the efficiency of esterification reactions. The methods comprising utilizing an annular gap reactor comprises a rotor rotating within a stator to provide an annular flow passage comprising a flow path containing a high-shear treatment zone in which the passage spacing is smaller than in the remainder of the zone to provide a subsidiary higher-shear treatment zone. In exemplary embodiments, the reactor is modified to include an evaporator portion including an opening in the stator near the end of the reactor and a series of fins placed in the opening. Increase in the rates due to the annular gap reactor allow for the use of less catalyst, poorer catalysts, lower temperature and reduction in unwanted side reactions at more economically favorable conditions.

Abstract: The present invention is directed to methods for producing substrates for electric circuits, particularly ultra high frequency circuits, and electric components for mounting thereon employing for the purpose mixtures of polymers and finely powdered filler materials, the latter having specific electric characteristics, such as dielectric constant and/or resistivity. Any one substrate or component can be manufactured to have at least two body regions, and even multiple body regions, each of which has a different characteristic such as dielectric constant or resistivity. The regions can be formed separately as substrate or component preforms and thereafter placed together in a mold and united into a single body by a heating and pressing operation that at least melts polymer at the junctions to bond them together. If necessary, the heat and pressure conditions are such as to melt the polymer and force it uniformly into the interstices between the filler particles to form a strong, unitary body.

Abstract: Composite materials, particularly those that are highly filled, e.g. comprising about 60 to 70 volume % of finely powdered filler material in a polymer matrix, are made by dissolving the polymer in a volatilisable solvent and forming a homogeneous mixture of the components by high shear mixing. The solvent is then removed while maintaining complete homogeneity in the mixture by evaporating much of the solvent in a high shear mill, then extruding an extremely thin film or tape (e.g. 0.0125 mm (0.0005 in)) from which the remaining solvent is removed by heating without introducing any appreciable non-uniformity, such as bubble holes. Required bodies are formed from the dried film or tape by stacking the thin coherent layers, typically about 6 to 120, then heating and pressing the stack in a mold melting the polymer, uniting the separate layers and dispersing the melted polymer into the interstices between the filler particles.

Abstract: Composite materials, particularly those that are highly filled, e.g. comprising about 60 to 70 volume % of finely powdered filler material in a polymer matrix, are made by dissolving the polymer in a volatilisable solvent and forming a homogeneous mixture of the components by high shear mixing. The solvent is then removed while maintaining complete homogeneity in the mixture by evaporating much of the solvent in a high shear mill, then extruding an extremely thin film or tape (e.g. 0.0125 mm (0.0005 in)) from which the remaining solvent is removed by heating without introducing any appreciable non-uniformity, such as bubble holes. Required bodies are formed from the dried film or tape by stacking the thin coherent layers, typically about 6 to 120, then heating and pressing the stack in a mold melting the polymer, uniting the separate layers and dispersing the melted polymer into the interstices between the filler particles.

Abstract: A micro-optical switch including a flexureless magnetic micromirror hinged centrally over a pin, cone or the like. The pin, cone or the like allows the micromirror to rapidly switch or tilt into a plurality of predefined positions as accurately controlled by an microelectromagnetic assembly. A liquid surrounds the pin or cone, connects the bottom of the surface of the mirror with the substrate supporting the pin or cone, and provides a capillary force holding the mirror onto the pin or cone. The liquid low vapor pressure also dissipates heat generated by the fiberoptic beam reflecting off the top surface of the micromirror.

Abstract: Highly filled composite materials, e.g. comprising approximately 60 volume % or greater of finely powdered particles of filler in a polymer matrix, are made by dissolving polymer in a volatilisable solvent, adding filler and forming a homogeneous mixture by high shear mixing. Most solvent is then removed while maintaining homogeneity in the mixture, preferably by evaporation in a high shear mill. Then, extruding a thin layer of the composite material and removing remaining solvent, as by heating. Bodies are formed from the dried layer, which are heated and pressed to melt and disperse melted polymer into the interstices between filler particles. Thereby, certain polymers unusable at low solids contents become effective bonding materials at high solids contents. Filler materials are chosen to tailor electrical and physical properties of the articles, which may comprise substrates for electronic circuits. Suitable polymers are certain polyarylene ethers soluble in cyclohexanone.

Abstract: The present invention is directed to methods for producing substrates (24) for electric circuits, particularly ultra high frequency circuits, and electric components (44-48) for mounting thereon employing for the purpose mixtures of polymers and finely powdered filler materials, the latter having specific electric characteristics, such as dielectric constant and/or resistivity. Any one substrate or component can be manufactured to have at least two body regions (241, 242), and even multiple body regions (241-24n), each of which has a different characteristic such as dielectric constant (&Sgr;1-&Sgr;n respectively) or resistivity (R1-Rn respectively). The regions can be formed separately as substrate or component preforms and thereafter placed together in a mold and united into a single body by a heating and pressing operation that at least melts polymer at the junctions to bond them together.

Abstract: Highly filled composite materials, e.g. comprising approximately 60 volume % or greater of finely powdered particles of filler in a polymer matrix, are made by dissolving polymer in a volatilisable solvent, adding filler and forming a homogeneous mixture by high shear mixing. Most solvent is then removed while maintaining homogeneity in the mixture, preferably by evaporation in a high shear mill. Then, extruding a thin layer of the composite material and removing remaining solvent, as by heating. Bodies are formed from the dried layer, which are heated and pressed to melt and disperse melted polymer into the interstices between filler particles. Thereby, certain polymers unusable at low solids contents become effective bonding materials at high solids contents. Filler materials are chosen to tailor electrical and physical properties of the articles, which may comprise substrates for electronic circuits. Suitable polymers are certain polyarylene ethers soluble in cyclohexanone.

Abstract: A micro-optical switch including a flexureless magnetic micromirror hinged centrally over a pin, cone or the like. The pin, cone or the like allows the micromirror to rapidly switch or tilt into a plurality of predefined positions as accurately controlled by an microelectromagnetic assembly. A liquid surrounds the pin or cone, connects the bottom of the surface of the mirror with the substrate supporting the pin or cone, and provides a capillary force holding the mirror onto the pin or cone. The liquid low vapor pressure also dissipates heat generated by the fiberoptic beam reflecting off the top surface of the micromirror.

Abstract: A plastic multipin connector that provides an optical-electronic interface between the end of a fiberoptic cable and an electronic circuit utilizes a flexible multilayer printed circuit with a ground plane layer on the outside of the folded circuit within a plastic housing and an upright tab intact with the ground plane layer on the outside of the tab and at least one patterned conductor layer. The upright tab is used to make connections of the optoelectronic device with the printed circuit at the base of the device leads to virtually eliminate any lead length from the device to the printed circuit that is not shielded from external noise.