Patents by Inventor Philip Layne
Philip Layne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11810754Abstract: A system and method for optimizing a ribbon ion beam in a beam line implantation system is disclosed. The system includes a calibration sensor disposed in the beam line after the mass analyzer. The calibration sensor is able to measure both the total current of the ribbon ion beam, as well as provide information about its vertical position. Information from the calibration sensor can then be utilized by a controller to adjust various parameters to improve the density as well as the vertical position. In some embodiments, the calibration sensor may include a plurality of Faraday sensors, where, both the total current and the vertical position of the ion beam can be determined. Furthermore, the focus of the ion beam can be estimated based on the distribution of the current in the height direction.Type: GrantFiled: December 9, 2021Date of Patent: November 7, 2023Assignee: Applied Materials, Inc.Inventors: Eric D. Hermanson, Nevin Clay, Antonella Cucchetti, Philip Layne, Sudhakar Mahalingam, Michael Simmons
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Publication number: 20230187171Abstract: A system and method for optimizing a ribbon ion beam in a beam line implantation system is disclosed. The system includes a calibration sensor disposed in the beam line after the mass analyzer. The calibration sensor is able to measure both the total current of the ribbon ion beam, as well as provide information about its vertical position. Information from the calibration sensor can then be utilized by a controller to adjust various parameters to improve the density as well as the vertical position. In some embodiments, the calibration sensor may include a plurality of Faraday sensors, where, both the total current and the vertical position of the ion beam can be determined. Furthermore, the focus of the ion beam can be estimated based on the distribution of the current in the height direction.Type: ApplicationFiled: December 9, 2021Publication date: June 15, 2023Inventors: Eric D. Hermanson, Nevin Clay, Antonella Cucchetti, Philip Layne, Sudhakar Mahalingam, Michael Simmons
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Patent number: 11222768Abstract: Disclosed is a semiconductor processing apparatus including one or more components having a conductive or nonconductive porous material. In some embodiments, an ion implanter may include a plurality of beam line components for directing an ion beam to a target, and a porous material along a surface of at least one of the plurality of beamline components.Type: GrantFiled: August 26, 2019Date of Patent: January 11, 2022Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: James Alan Pixley, Eric D. Hermanson, Philip Layne, Lyudmila Stone, Thomas Stacy
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Patent number: 10867772Abstract: Provided herein are approaches for increasing surface area of a conductive beam optic by providing grooves or surface features thereon. In one approach, the conductive beam optic may be part of an electrostatic filter having a plurality of conductive beam optics disposed along an ion beam-line, wherein at least one conductive beam optic includes a plurality of grooves formed in an exterior surface. In some approaches, a power supply may be provided in communication with the plurality of conductive beam optics, wherein the power supply is configured to supply a voltage and a current to the plurality of conductive beam optics. The plurality of grooves may be provided in a spiral pattern along a length of the conductive beam optic, and/or oriented parallel to a lengthwise axis of the conductive beam optic.Type: GrantFiled: March 19, 2018Date of Patent: December 15, 2020Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Eric Hermanson, Philip Layne, James Alan Pixley
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Patent number: 10643823Abstract: Disclosed is a semiconductor processing apparatus including one or more components having a conductive or nonconductive foam material. In some embodiments, the component is a plasma flood gun including a shield assembly coupled to the plasma flood gun. The shield assembly may include a first shield having a first main side facing an ion beam target, and a connection block coupled to a second main side of the first shield. The shield assembly may further include a mounting plate coupled to the connection block, and a second shield coupled to the mounting plate by a bracket. In some embodiments, the first shield and/or one or more process chamber walls includes a foam material, such as a conductive or nonconductive foam.Type: GrantFiled: October 16, 2018Date of Patent: May 5, 2020Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: James Alan Pixley, Eric D. Hermanson, Philip Layne, Lyudmila Stone, Thomas Stacy
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Publication number: 20200083021Abstract: Disclosed is a semiconductor processing apparatus including one or more components having a conductive or nonconductive porous material. In some embodiments, an ion implanter may include a plurality of beam line components for directing an ion beam to a target, and a porous material along a surface of at least one of the plurality of beamline components.Type: ApplicationFiled: August 26, 2019Publication date: March 12, 2020Applicant: Varian Semiconductor Equipment Associates, Inc.Inventors: James Alan Pixley, Eric D. Hermanson, Philip Layne, Lyudmila Stone, Thomas Stacy
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Publication number: 20200083027Abstract: Disclosed is a semiconductor processing apparatus including one or more components having a conductive or nonconductive foam material. In some embodiments, the component is a plasma flood gun including a shield assembly coupled to the plasma flood gun. The shield assembly may include a first shield having a first main side facing an ion beam target, and a connection block coupled to a second main side of the first shield. The shield assembly may further include a mounting plate coupled to the connection block, and a second shield coupled to the mounting plate by a bracket. In some embodiments, the first shield and/or one or more process chamber walls includes a foam material, such as a conductive or nonconductive foam.Type: ApplicationFiled: October 16, 2018Publication date: March 12, 2020Applicant: Varian Semiconductor Equipment Associates, Inc.Inventors: James Alan Pixley, Eric D. Hermanson, Philip Layne, Lyudmila Stone, Thomas Stacy
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Publication number: 20200020508Abstract: Provided herein are approaches for increasing surface area of a conductive beam optic by providing grooves or surface features thereon. In one approach, the conductive beam optic may be part of an electrostatic filter having a plurality of conductive beam optics disposed along an ion beam-line, wherein at least one conductive beam optic includes a plurality of grooves formed in an exterior surface. In some approaches, a power supply may be provided in communication with the plurality of conductive beam optics, wherein the power supply is configured to supply a voltage and a current to the plurality of conductive beam optics. The plurality of grooves may be provided in a spiral pattern along a length of the conductive beam optic, and/or oriented parallel to a lengthwise axis of the conductive beam optic.Type: ApplicationFiled: March 19, 2018Publication date: January 16, 2020Applicant: Varian Semiconductor Equipment Associates, Inc.Inventors: Eric Hermanson, Philip Layne, James Alan Pixley
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Patent number: 10199257Abstract: Embodiments of the disclosure include a fixed position mask for workpiece edge treatment. In some embodiments, an apparatus includes a roplat having a rotatable assembly, and a platen coupled to the rotatable assembly, wherein the platen is configured to hold a workpiece. The apparatus further includes a bracket affixed to the rotatable assembly, and a mask directly coupled to the bracket, wherein the mask is positioned adjacent the workpiece. The mask covers an inner portion of the platen and the workpiece, leaving just an outer circumferential edge of the workpiece exposed to an ion treatment. In some embodiments, the platen is permitted to rotate relative to the bracket during an ion treatment. In some embodiments, the mask includes a solid plate section devoid of any openings, and a mounting portion extending from the plate section, wherein the mounting portion is directly coupled to an extension arm of the bracket.Type: GrantFiled: May 25, 2017Date of Patent: February 5, 2019Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.Inventors: Fletcher Ian Potter, Philip Layne, Keith A. Fernlund, Michael Swears, Richard Allen Sprenkle
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Publication number: 20180342413Abstract: Embodiments of the disclosure include a fixed position mask for workpiece edge treatment. In some embodiments, an apparatus includes a roplat having a rotatable assembly, and a platen coupled to the rotatable assembly, wherein the platen is configured to hold a workpiece. The apparatus further includes a bracket affixed to the rotatable assembly, and a mask directly coupled to the bracket, wherein the mask is positioned adjacent the workpiece. The mask covers an inner portion of the platen and the workpiece, leaving just an outer circumferential edge of the workpiece exposed to an ion treatment. In some embodiments, the platen is permitted to rotate relative to the bracket during an ion treatment. In some embodiments, the mask includes a solid plate section devoid of any openings, and a mounting portion extending from the plate section, wherein the mounting portion is directly coupled to an extension arm of the bracket.Type: ApplicationFiled: May 25, 2017Publication date: November 29, 2018Applicant: Varian Semiconductor Equipment Associates, Inc.Inventors: Fletcher Ian Potter, Philip Layne, Keith A. Fernlund, Michael Swears, Richard Allen Sprenkle
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Patent number: 10074514Abstract: An apparatus may include an electrode system, the electrode system comprising a plurality of electrodes to guide an ion beam from an entrance aperture to an exit aperture, and a voltage supply to apply a plurality of voltages to the electrode system. The electrode system may comprise an exit electrode assembly, where the exit electrode assembly includes a first exit electrode and a second exit electrode, separated from the first exit electrode by an electrode gap. The first exit electrode and the second exit electrode may be movable with respect to one another so as to change a size of the electrode gap over a gap range.Type: GrantFiled: September 8, 2017Date of Patent: September 11, 2018Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.Inventors: Shengwu Chang, Frank Sinclair, Alexandre Likhanskii, Philip Layne