Patents by Inventor Philip Lessner

Philip Lessner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7745281
    Abstract: An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: June 29, 2010
    Assignees: Kemet Electronics Corporation, Motorola, Inc.
    Inventors: John D. Prymak, Chris Stolarski, David Jacobs, Chris Wayne, Philip Lessner, John T. Kinard, Alethia Melody, Gregory Dunn, Robert T. Croswell, Remy J. Chelini
  • Publication number: 20080216296
    Abstract: An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.
    Type: Application
    Filed: February 14, 2008
    Publication date: September 11, 2008
    Inventors: John D. Prymak, Chris Stolarski, David Jacobs, Chris Wayne, Philip Lessner, John T. Kinard, Alethia Melody, Gregory Dunn, Robert T. Croswell, Remy J. Chelini
  • Publication number: 20080123251
    Abstract: A process for forming a capacitive couple. The process includes forming a highly porous body of a conducting material with interior struts and voids in electrical contact. A dielectric layer is formed in the voids on the struts with a material having a dielectric constant above 100. An insulating layer is formed on the struts not covered by the dielectric layer. A conductive layer is formed on the dielectric layer and on the insulating layer.
    Type: Application
    Filed: November 28, 2006
    Publication date: May 29, 2008
    Inventors: Michael S. Randall, Peter Blais, Pascal Pinceloup, Daniel J. Skamser, Abhijit Gurav, Azizuddin Tajuddin, John T. Kinard, Philip Lessner
  • Publication number: 20070274025
    Abstract: A capacitor includes a container, a positive electrode, a negative electrode, and a fluid electrolyte. The positive electrode comprises a metal substrate and an active material provided in contact with the metal substrate, the active material comprising at least one of poly (ethylene 3,4-dioxythiophene) and a titanate.
    Type: Application
    Filed: August 9, 2007
    Publication date: November 29, 2007
    Inventors: Philip Lessner, Brian Melody, John Kinard, Joachim Schott
  • Publication number: 20070242412
    Abstract: An improved capacitor with an anode with an anode wire and an oxide layer on the surface of the anode. A cathode layer is exterior to the oxide layer. A carbon conductive layer is exterior to the cathode layer wherein the cathode layer comprises 5-75 wt % resin and 25-95 wt % conductor. The conductor has carbon nanotubes. An anode lead is in electrical contact with the anode wire and a cathode lead is in electrical contact with the carbon conductive layer.
    Type: Application
    Filed: May 14, 2007
    Publication date: October 18, 2007
    Inventors: Antony Chacko, Qingping Chen, Randy Hahn, John Kinard, Philip Lessner, Brian Melody
  • Publication number: 20070171596
    Abstract: An improved capacitor with an anode with an anode wire and an oxide layer on the surface of the anode. A cathode layer is exterior to the oxide layer. A carbon conductive layer is exterior to the cathode layer wherein the cathode layer comprises 5-75 wt % resin and 25-95 wt % conductor. The conductor has carbon nanotubes. An anode lead is in electrical contact with the anode wire and a cathode lead is in electrical contact with the carbon conductive layer.
    Type: Application
    Filed: January 20, 2006
    Publication date: July 26, 2007
    Inventors: Antony Chacko, Qingping Chen, Randy Hahn, John Kinard, Philip Lessner, Brian Melody, Anita Melody
  • Publication number: 20070139864
    Abstract: Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymerlayer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
    Type: Application
    Filed: December 21, 2005
    Publication date: June 21, 2007
    Inventors: Gregory Dunn, Remy Chelini, Robert Croswell, Philip Lessner, Michael Prevallet, John Prymak
  • Publication number: 20050164508
    Abstract: A capacitor and method for manufacturing the capacitor. The capacitor comprises an anode; a dielectric oxide layer coated on the anode and a plurality of conductive islands coated on the dielectric oxide layer. An organic conductive cathode is coated on the dielectric layer and conductive islands.
    Type: Application
    Filed: January 18, 2005
    Publication date: July 28, 2005
    Inventors: Keith Brenneman, Keith Moore, Philip Lessner