Patents by Inventor Philip Lyndon R. Cablao

Philip Lyndon R. Cablao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked die semiconductor device having circuit tape
    Patent number: 7786575
    Abstract: A stacked die semiconductor package includes a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The at least one component may include one or more passive components, one or more active components, or a combination of passive and active components. The stacked die semiconductor package can also include a second circuit tape coupled to the second integrated circuit chip and a third integrated circuit chip coupled to the second circuit tape. The stacked die semiconductor package can also include an encapsulant.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: August 31, 2010
    Assignee: STATS ChipPAC Ltd.
    Inventors: Philip Lyndon R. Cablao, Dario S. Filoteo, Jr., Emmanuel A. Espiritu, Leo A. Merilo
  • STACKED DIE SEMICONDUCTOR DEVICE HAVING CIRCUIT TAPE
    Publication number: 20100078794
    Abstract: A stacked die semiconductor package includes a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The at least one component may include one or more passive components, one or more active components, or a combination of passive and active components. The stacked die semiconductor package can also include a second circuit tape coupled to the second integrated circuit chip and a third integrated circuit chip coupled to the second circuit tape. The stacked die semiconductor package can also include an encapsulant.
    Type: Application
    Filed: December 4, 2009
    Publication date: April 1, 2010
    Inventors: Philip Lyndon R. Cablao, Dario S. Filoteo, JR., Emmanuel A. Espiritu, Leo A. Merilo
  • Stacked die semiconductor device having circuit tape
    Patent number: 7659608
    Abstract: A stacked die semiconductor package includes a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The at least one component may include one or more passive components, one or more active components, or a combination of passive and active components. The stacked die semiconductor package can also include a second circuit tape coupled to the second integrated circuit chip and a third integrated circuit chip coupled to the second circuit tape. The stacked die semiconductor package can also include an encapsulant.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: February 9, 2010
    Assignee: Stats Chippac Ltd.
    Inventors: Philip Lyndon R. Cablao, Dario S. Filoteo, Jr., Emmanuel A. Espiritu, Leo A. Merilo
  • STACKED DIE SEMICONDUCTOR PACKAGE
    Publication number: 20080067658
    Abstract: A stacked die semiconductor package comprises a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The at least one component may include one or more passive components, one or more active components, or a combination of passive and active components. The stacked die semiconductor package can also comprise a second circuit tape coupled to the second integrated circuit chip and a third integrated circuit chip coupled to the second circuit tape. The stacked die semiconductor package can also comprise an encapsulant.
    Type: Application
    Filed: September 15, 2006
    Publication date: March 20, 2008
    Inventors: Philip Lyndon R. Cablao, Dario S. Filoteo, Emmanuel A. Espiritu, Leo A. Merilo