Patents by Inventor Philip M. Clovis

Philip M. Clovis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DUAL PHYSICAL LAYER TRANSCEIVERS FOR HIGH SPEED SYNCHRONOUS INTERFACE (HSI) FRAME INTERLEAVING
    Publication number: 20130100949
    Abstract: An apparatus including dual physical layer transceivers for high speed synchronous interface (HSI) frame interleaving. The apparatus includes a first physical layer transceiver and a second physical layer transceiver. The apparatus further includes a frame interleaver that is communicably coupled to each of the first and second physical layer transceivers. The frame interleaver is operable to interleave a protocol data unit (PDU) of high speed synchronous interface (HSI) frames across uplink lanes of the first physical layer transceiver and uplink lanes of the second physical layer transceiver according to a pipe offset.
    Type: Application
    Filed: October 25, 2011
    Publication date: April 25, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Hans Georg Gruber, Philip M. Clovis