Patents by Inventor Philip M. Henault

Philip M. Henault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250107006
    Abstract: A printed circuit board comprises a support structure, a conductive layer operably coupled to the support structure, a mask structure formed on the conductive layer, and a cover layer. The conductive layer comprises first and second portions of conductive material separated by a gap that defines a spacing between the first and second portions that does not contain conductive material. The mask structure defines first and second regions on the conductive layer. The first region is enclosed by a first boundary defined by the mask structure and includes the gap. The second region lies outside of the first boundary. The cover layer is sized to fit within the first region and comprises a laminatible insulating material that flows within the first region during lamination. During lamination, the first boundary prevents the laminatible insulating material from flowing into the second region, and the laminatible insulating material flows to fill the gap.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 27, 2025
    Applicant: Raytheon Company
    Inventors: Angelo M. Puzella, Philip M. Henault, Alexander B. Brailovsky
  • Patent number: 11558957
    Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: January 17, 2023
    Assignees: Raytheon Company, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
    Inventors: David H. Altman, Christopher H. Peters, Gregory P. Schaefer, Philip M. Henault, Darin J. Sharar
  • Publication number: 20210392737
    Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 16, 2021
    Inventors: David H. Altman, Christopher H. Peters, Gregory P. Schaefer, Philip M. Henault, Darin J. Sharar
  • Patent number: 10276282
    Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center, and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: April 30, 2019
    Assignee: Raytheon Company
    Inventors: Angelo M. Puzella, Lance A. Auer, Norman Armendariz, Donald A. Bozza, John B. Francis, Philip M. Henault, Randal W. Oberle, Susan C. Trulli, Dimitry Zarkh
  • Publication number: 20190035517
    Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center, and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
    Type: Application
    Filed: July 28, 2017
    Publication date: January 31, 2019
    Applicant: Raytheon Company
    Inventors: Angelo M. Puzella, Lance A. Auer, Norman Armendariz, Donald A. Bozza, John B. Francis, Philip M. Henault, Randal W. Oberle, Susan C. Trulli, Dimitry Zarkh
  • Publication number: 20180183146
    Abstract: A via-less beamformer provided from a plurality of circuits elements having circuit layouts selected to mitigate unwanted reactive coupling there between. At least one of the plurality of circuit elements is provided having a circuit layout selected based upon reactive field theory. In one embodiment, a circuit layout may be selected by: determining which circuit features of the circuit elements produce reactive fields in response to a signal provided thereto, separating the total field into a modal set and determining the modal weighting coefficients based on geometrical and/or design features of the of the circuit elements. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits. In one embodiment the via-less beamformer comprises one or more branch hybrid coupler circuits. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits and one or more branch hybrid coupler circuits.
    Type: Application
    Filed: December 27, 2016
    Publication date: June 28, 2018
    Applicant: Raytheon Company
    Inventors: Thomas V. Sikina, John P. Haven, Philip M. Henault, Alkim Akyurtlu
  • Patent number: 9584080
    Abstract: A power amplifier structure having: a power divider for dividing power in a signal fed to an input port between a pair of output ports. Each one of a pair of amplifiers has: an input coupled to a corresponding one of the pair of power divider output ports; and an output. A power combiner is provided. Signals at the power divider output ports are fed to the inputs of the pair of amplifiers in a forward direction and then pass through the amplifiers in the forward direction towards the outputs of the pair of amplifiers. Connectors direct the signals at the amplifier outputs to the power combiners, the signal then passing through the power combiner to an output port in a direction opposite to the forward direction.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: February 28, 2017
    Assignee: Raytheon Company
    Inventors: Christopher M. Laighton, James A. Robbins, Jonathan B. Langille, Philip M. Henault
  • Publication number: 20160248392
    Abstract: A power amplifier structure having: a power divider for dividing power in a signal fed to an input port between a pair of output ports. Each one of a pair of amplifiers has: an input coupled to a corresponding one of the pair of power divider output ports; and an output. A power combiner is provided. Signals at the power divider output ports are fed to the inputs of the pair of amplifiers in a forward direction and then pass through the amplifiers in the forward direction towards the outputs of the pair of amplifiers. Connectors direct the signals at the amplifier outputs to the power combiners, the signal then passing through the power combiner to an output port in a direction opposite to the forward direction.
    Type: Application
    Filed: February 23, 2015
    Publication date: August 25, 2016
    Applicant: Raytheon Company
    Inventors: Christopher M. Laighton, James A. Robbins, Jonathan B. Langille, Philip M. Henault