Abstract: A multi-tapped surface mount inductor (300) providing high quality factor (Q) and high inductance is capable of being surface mounted on any of its four sides. An inner substrate layer(s) (322) is provided with metallized patterns (328, 332) and vias (336) to form a multi-turn coil. The inner substrate layer (322) is then sandwiched between first and second outer substrate layers (324, 326) to form a six sided structure. Tapped element(s) (304) can be tapped off the multi-turn coil in increments of a quarter turn or less to provide a multi-tapped surface mount inductor capable of being mounted an any of its' four side surfaces (310, 312, 314, 316). When tapped element(s) (204) are tapped symmetrically between the input/output ends (214, 216), the surface mount inductor (200) may interchange its' input/output ends (214, 216) making the component surface mountable in eight different positions.

Abstract: A frequency modulator (100) is provided which includes a VCO (200) having a modulation varactor (122) coupled to its output (128). The VCO (200) includes a resonator stage (112) coupled to an amplifier stage comprising a transistor (118). Coupling of the varactor (122) and the resonator stage (112) is provided via the phase collector capacitance (C.mu.) of the transistor (118).

Abstract: A transmission line structure comprises a dielectric substrate (11) having first and second opposing sides separated by a first distance (3). A transmission line (13) is disposed on the first side while an opposed conductor (12) is disposed on the second side. The transmission line (13) has a first edge (4) a second edge (6), and a midde portion (8). Thicknesswise, the middle portion (8) is separated from the opposed conductor by the first distance (3), and at least a portion of the first edge (4) is separated from the opposed conductor by a second distance less than the first distance (3).