Patents by Inventor Philip Medwell Brown

Philip Medwell Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9850031
    Abstract: Simulated commercial envelopes and methods of making are disclosed. An example envelope includes a first envelope portion having a front panel. A top flap is integrally formed with a top edge of the front panel about a first fold line, and a bottom flap is integrally formed with a bottom edge-of the front panel about a second fold line. A second envelope portion includes a rear panel free of any fold lines or flaps. The rear panel is to be secured to the front panel to form a pocket at least partially surrounding the mailer. The bottom flap is to be folded about the second fold line and to be secured to the rear panel on a side opposite the formed pocket. The top flap is to be folded about the first fold line and to be secured over the rear panel on the side opposite the formed pocket.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: December 26, 2017
    Assignee: R.R. Donnelley & Sons Company
    Inventor: Philip Medwell Brown
  • Publication number: 20130026216
    Abstract: Simulated commercial envelopes and methods of making are disclosed. An example envelope includes a first envelope portion having a front panel. A top flap is integrally formed with a top edge of the front panel about a first fold line, and a bottom flap is integrally formed with a bottom edge-of the front panel about a second fold line. A second envelope portion includes a rear panel free of any fold lines or flaps. The rear panel is to be secured to the front panel to form a pocket at least partially surrounding the mailer. The bottom flap is to be folded about the second fold line and to be secured to the rear panel on a side opposite the formed pocket. The top flap is to be folded about the first fold line and to be secured over the rear panel on the side opposite the formed pocket.
    Type: Application
    Filed: August 8, 2012
    Publication date: January 31, 2013
    Inventor: Philip Medwell Brown
  • Patent number: 8256194
    Abstract: Simulated commercial envelopes and methods of making the same are disclosed. An example envelope includes a first envelope portion having a front panel including a top edge and a bottom edge parallel to the top edge, connected by a pair of side edges. A top flap is integrally formed with the top edge of the front panel about a first fold line and a bottom flap is integrally formed with the bottom edge of the front panel about a second fold line. A second envelope portion having a rear panel is adapted to be secured to the front panel to form a pocket for a mailer insert. The bottom flap foldable about the second fold line and is secured to the rear panel on a side opposite the formed pocket, and the top flap is foldable about the first fold line and is also secured to the rear panel or the bottom flap on the side opposite the formed pocket to form the example envelope.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: September 4, 2012
    Assignee: R.R.Donnelley & Sons Company
    Inventor: Philip Medwell Brown
  • Publication number: 20090321502
    Abstract: Simulated commercial envelopes and methods of making the same are disclosed. An example envelope includes a first envelope portion having a front panel including a top edge and a bottom edge parallel to the top edge, connected by a pair of side edges. A top flap is integrally formed with the top edge of the front panel about a first fold line and a bottom flap is integrally formed with the bottom edge of the front panel about a second fold line. A second envelope portion having a rear panel is adapted to be secured to the front panel to form a pocket for a mailer insert. The bottom flap foldable about the second fold line and is secured to the rear panel on a side opposite the formed pocket, and the top flap is foldable about the first fold line and is also secured to the rear panel or the bottom flap on the side opposite the formed pocket to form the example envelope.
    Type: Application
    Filed: June 27, 2008
    Publication date: December 31, 2009
    Inventor: Philip Medwell Brown