Patents by Inventor Philip Moon
Philip Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11493960Abstract: An example electronic device cover includes a body component to attach to an electronic device. The body component articulates among a first, second, and third configuration. The body component includes a first section to attach to the electronic device. A second section attaches to the first section, bends with respect to the first section, and provides structural support to the electronic device in the second configuration. A third section attaches to the second section, and bends with respect to the second section. A fourth section attaches to the third section and includes a rotatable data port. An input device attaches to the fourth section and is operatively connected to the data port. The input device is to be held against and face the electronic device in the third configuration. The body component constrains the electronic device within a perimeter boundary of the fourth section in the first and third configurations.Type: GrantFiled: January 5, 2018Date of Patent: November 8, 2022Assignee: Hewlett-Packard Development Company, L. P.Inventors: Philip Moon, Ilchan Lee, Stacy L. Wolff
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Patent number: 11476621Abstract: Connection assemblies are disclosed herein for use with a computing device. In some examples, the connection assembly includes a collar that is rotatably disposed about a first connector and is transitionable between a first position and a second position. When the collar is in the first position, shoulders of a second connector coupled to the first connector interfere with corresponding shoulders within the collar to prevent withdrawal of the second connector from the first connector. When the collar is in the second position, the shoulders of the second connector are misaligned with the corresponding shoulders within the collar so that the second connector is freely removable from the first connector.Type: GrantFiled: July 11, 2018Date of Patent: October 18, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Philip Moon, Marcus Townsend
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Patent number: 11360510Abstract: In example implementations, a cover for electronic devices is provided. The cover for electronic devices includes a first cover, a second cover, and a flexible spine coupled to the first cover and the second cover. The first cover includes a first folding groove. The second cover includes a second folding groove. The first cover folds in half along the first folding groove and the second cover folds against the second folding groove when the flexible spine is rotated into an open position.Type: GrantFiled: June 5, 2018Date of Patent: June 14, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventor: Philip Moon
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Publication number: 20210149446Abstract: In example implementations, a cover for electronic devices is provided. The cover for electronic devices includes a first cover, a second cover, and a flexible spine coupled to the first cover and the second cover. The first cover includes a first folding groove. The second cover includes a second folding groove. The first cover folds in half along the first folding groove and the second cover folds against the second folding groove when the flexible spine is rotated into an open position.Type: ApplicationFiled: June 5, 2018Publication date: May 20, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventor: Philip Moon
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Publication number: 20210119383Abstract: Connection assemblies are disclosed herein for use with a computing device. In some examples, the connection assembly includes a collar that is rotatably disposed about a first connector and is transitionable between a first position and a second position. When the collar is in the first position, shoulders of a second connector coupled to the first connector interfere with corresponding shoulders within the collar to prevent withdrawal of the second connector from the first connector. When the collar is in the second position, the shoulders of the second connector are misaligned with the corresponding shoulders within the collar so that the second connector is freely removable from the first connector.Type: ApplicationFiled: July 11, 2018Publication date: April 22, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Philip Moon, Marcus Townsend
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Publication number: 20200333841Abstract: An example electronic device cover includes a body component to attach to an electronic device. The body component articulates among a first, second, and third configuration. The body component includes a first section to attach to the electronic device. A second section attaches to the first section, bends with respect to the first section, and provides structural support to the electronic device in the second configuration. A third section attaches to the second section, and bends with respect to the second section. A fourth section attaches to the third section and includes a rotatable data port. An input device attaches to the fourth section and is operatively connected to the data port. The input device is to be held against and face the electronic device in the third configuration. The body component constrains the electronic device within a perimeter boundary of the fourth section in the first and third configurations.Type: ApplicationFiled: January 5, 2018Publication date: October 22, 2020Inventors: Philip Moon, Ilchan Lee, Stacy L. Wolff
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Patent number: D865756Type: GrantFiled: April 3, 2018Date of Patent: November 5, 2019Assignee: Hewlett-Packard Development Company, L.P.Inventor: Philip Moon
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Patent number: D871393Type: GrantFiled: April 3, 2018Date of Patent: December 31, 2019Assignee: Hewlett-Packard Development Company, L.P.Inventor: Philip Moon
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Patent number: D880473Type: GrantFiled: April 5, 2018Date of Patent: April 7, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventor: Philip Moon
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Patent number: D887404Type: GrantFiled: May 18, 2018Date of Patent: June 16, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Philip Moon, Ilchan Lee
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Patent number: D890167Type: GrantFiled: May 7, 2018Date of Patent: July 14, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventor: Philip Moon
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Patent number: D901486Type: GrantFiled: January 5, 2018Date of Patent: November 10, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Philip Moon, Ilchan Lee, Kevin L. Massaro