Patents by Inventor Philip Moon

Philip Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11493960
    Abstract: An example electronic device cover includes a body component to attach to an electronic device. The body component articulates among a first, second, and third configuration. The body component includes a first section to attach to the electronic device. A second section attaches to the first section, bends with respect to the first section, and provides structural support to the electronic device in the second configuration. A third section attaches to the second section, and bends with respect to the second section. A fourth section attaches to the third section and includes a rotatable data port. An input device attaches to the fourth section and is operatively connected to the data port. The input device is to be held against and face the electronic device in the third configuration. The body component constrains the electronic device within a perimeter boundary of the fourth section in the first and third configurations.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 8, 2022
    Assignee: Hewlett-Packard Development Company, L. P.
    Inventors: Philip Moon, Ilchan Lee, Stacy L. Wolff
  • Patent number: 11476621
    Abstract: Connection assemblies are disclosed herein for use with a computing device. In some examples, the connection assembly includes a collar that is rotatably disposed about a first connector and is transitionable between a first position and a second position. When the collar is in the first position, shoulders of a second connector coupled to the first connector interfere with corresponding shoulders within the collar to prevent withdrawal of the second connector from the first connector. When the collar is in the second position, the shoulders of the second connector are misaligned with the corresponding shoulders within the collar so that the second connector is freely removable from the first connector.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: October 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Philip Moon, Marcus Townsend
  • Patent number: 11360510
    Abstract: In example implementations, a cover for electronic devices is provided. The cover for electronic devices includes a first cover, a second cover, and a flexible spine coupled to the first cover and the second cover. The first cover includes a first folding groove. The second cover includes a second folding groove. The first cover folds in half along the first folding groove and the second cover folds against the second folding groove when the flexible spine is rotated into an open position.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: June 14, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Philip Moon
  • Publication number: 20210149446
    Abstract: In example implementations, a cover for electronic devices is provided. The cover for electronic devices includes a first cover, a second cover, and a flexible spine coupled to the first cover and the second cover. The first cover includes a first folding groove. The second cover includes a second folding groove. The first cover folds in half along the first folding groove and the second cover folds against the second folding groove when the flexible spine is rotated into an open position.
    Type: Application
    Filed: June 5, 2018
    Publication date: May 20, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventor: Philip Moon
  • Publication number: 20210119383
    Abstract: Connection assemblies are disclosed herein for use with a computing device. In some examples, the connection assembly includes a collar that is rotatably disposed about a first connector and is transitionable between a first position and a second position. When the collar is in the first position, shoulders of a second connector coupled to the first connector interfere with corresponding shoulders within the collar to prevent withdrawal of the second connector from the first connector. When the collar is in the second position, the shoulders of the second connector are misaligned with the corresponding shoulders within the collar so that the second connector is freely removable from the first connector.
    Type: Application
    Filed: July 11, 2018
    Publication date: April 22, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Philip Moon, Marcus Townsend
  • Publication number: 20200333841
    Abstract: An example electronic device cover includes a body component to attach to an electronic device. The body component articulates among a first, second, and third configuration. The body component includes a first section to attach to the electronic device. A second section attaches to the first section, bends with respect to the first section, and provides structural support to the electronic device in the second configuration. A third section attaches to the second section, and bends with respect to the second section. A fourth section attaches to the third section and includes a rotatable data port. An input device attaches to the fourth section and is operatively connected to the data port. The input device is to be held against and face the electronic device in the third configuration. The body component constrains the electronic device within a perimeter boundary of the fourth section in the first and third configurations.
    Type: Application
    Filed: January 5, 2018
    Publication date: October 22, 2020
    Inventors: Philip Moon, Ilchan Lee, Stacy L. Wolff
  • Patent number: D865756
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: November 5, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Philip Moon
  • Patent number: D871393
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: December 31, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Philip Moon
  • Patent number: D880473
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: April 7, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Philip Moon
  • Patent number: D887404
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: June 16, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Philip Moon, Ilchan Lee
  • Patent number: D890167
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: July 14, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Philip Moon
  • Patent number: D901486
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 10, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Philip Moon, Ilchan Lee, Kevin L. Massaro