Abstract: Methods of dispensing fluid are disclosed. A first applicator is positioned above a first dispense site at a first dispense region of a first electronic substrate by moving the first applicator using a primary positioner. A second applicator is simultaneously positioned above a first dispense site at a second dispense region of the first electronic substrate by moving the second applicator together with the first applicator using the primary positioner and moving the second applicator relative to the first applicator using a secondary positioner. It is then determined that the first or the second dispense region is misaligned relative to the other of the first or the second dispense region.

Abstract: Methods of dispensing fluid are disclosed. A first applicator is positioned above a first dispense site at a first dispense region of a first electronic substrate by moving the first applicator using a primary positioner. A second applicator is simultaneously positioned above a first dispense site at a second dispense region of the first electronic substrate by moving the second applicator together with the first applicator using the primary positioner and moving the second applicator relative to the first applicator using a secondary positioner. It is then determined that the first or the second dispense region is misaligned relative to the other of the first or the second dispense region.

Abstract: Methods for simultaneously dispensing a first fluid pattern at a first dispense region with a first applicator and a second fluid pattern at a second dispense region with a second applicator. The first and second applicators are moved toward their respective dispense regions with a positioner. While dispensing, the second applicator is moved relative to the first applicator in a direction or directions parallel to a first axis, a second axis, and/or a third axis, the axes being mutually orthogonal. The first dispense region may be provided with a unique first tilt and/or a unique first contour relative to the reference plane and along the third axis. Systems for dispensing fluid include a primary positioner supporting a first applicator, and a secondary positioner coupled to the primary positioner and supporting a second applicator and configured to move the second applicator relative to the first applicator.

Abstract: Methods for simultaneously dispensing a first fluid pattern at a first dispense region with a first applicator and a second fluid pattern at a second dispense region with a second applicator. The first and second applicators are moved toward their respective dispense regions with a positioner. While dispensing, the second applicator is moved relative to the first applicator in a direction or directions parallel to a first axis, a second axis, and/or a third axis, the axes being mutually orthogonal. The first dispense region may be provided with a unique first tilt and/or a unique first contour relative to the reference plane and along the third axis. Systems for dispensing fluid include a primary positioner supporting a first applicator, and a secondary positioner coupled to the primary positioner and supporting a second applicator and configured to move the second applicator relative to the first applicator.

Abstract: Systems for dispensing fluid in a first fluid pattern at a first dispense region and in a second fluid pattern at a second dispense region on one or more electronic substrates are disclosed. The system includes a primary positioner, a secondary positioner providing movement in the X axis direction and the Y axis direction relative to the primary positioner, a first applicator for dispensing fluid while being moved by the primary positioner, a second applicator for dispensing fluid while being moved by the primary positioner and/or the secondary positioner, a camera, and a controller. The controller determines a position of the first dispense region and a position of the second dispense region, controls movement of the primary positioner and the secondary positioner, and controls the first and second applicators to simultaneously dispense the first and second fluid patterns onto the respective first and second dispense regions.

Abstract: Methods of dispensing fluid are disclosed. A first applicator is positioned above a first dispense site at a first dispense region of a first electronic substrate by moving the first applicator using a primary positioner. A second applicator is simultaneously positioned above a first dispense site at a second dispense region of the first electronic substrate by moving the second applicator together with the first applicator using the primary positioner and moving the second applicator relative to the first applicator using a secondary positioner. It is then determined that the first or the second dispense region is misaligned relative to the other of the first or the second dispense region.

Abstract: Method of dispensing fluid are disclosed. The method initially determines, based upon an image of a first electronic substrate, that a first or a second dispense region is misaligned relative to the other of the first or the second dispense region. Fluid is dispensed from a first applicator while moving the first applicator using a primary positioner on the first electronic substrate to form a first fluid pattern. Fluid is simultaneously dispensed from a second applicator while moving the second applicator using the primary positioner and a secondary positioner. The method then determines, based upon an image of a second electronic substrate, that a first and a second dispense region of the second electronic substrate are aligned relative to one another. Fluid is simultaneously dispensed from the first applicator and the second applicator while moving the first applicator and the second applicator together using the primary positioner with first applicator.

Abstract: Methods for simultaneously dispensing a first fluid pattern at a first dispense region with a first applicator and a second fluid pattern at a second dispense region with a second applicator. The first and second applicators are moved toward their respective dispense regions with a positioner. While dispensing, the second applicator is moved relative to the first applicator in a direction or directions parallel to a first axis, a second axis, and/or a third axis, the axes being mutually orthogonal. The first dispense region may be provided with a unique first tilt and/or a unique first contour relative to the reference plane and along the third axis. Systems for dispensing fluid include a primary positioner supporting a first applicator, and a secondary positioner coupled to the primary positioner and supporting a second applicator and configured to move the second applicator relative to the first applicator.

Abstract: Methods for simultaneously dispensing a first fluid pattern at a first dispense region with a first applicator and a second fluid pattern at a second dispense region with a second applicator. The first and second applicators are moved toward their respective dispense regions with a positioner. While dispensing, the second applicator is moved relative to the first applicator in a direction or directions parallel to a first axis, a second axis, and/or a third axis, the axes being mutually orthogonal. The first dispense region may be provided with a unique first tilt and/or a unique first contour relative to the reference plane and along the third axis. Systems for dispensing fluid include a primary positioner supporting a first applicator, and a secondary positioner coupled to the primary positioner and supporting a second applicator and configured to move the second applicator relative to the first applicator.

Abstract: Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser are disclosed. Initially, a dispenser is continuously moved through a constant motion trajectory connecting the plurality of dispense locations on the substrate. The electrical output signals generated by one or more of encoders of the dispenser are monitored as the dispenser is continuously moved through the constant motion trajectory. The dispenser is triggered at each of the plurality of dispense locations and droplets of the fluid material are jetted while continuously moving the dispenser. The spatial coordinates of each droplet of the fluid material on the substrate are measured and compared to expected landing coordinates for each droplet of the fluid material to generate a spatial error for each droplet of the fluid material. At least one dispense location is corrected and an updated constant motion trajectory is generated.

Abstract: Methods for simultaneously dispensing a first fluid pattern at a first dispense region with a first applicator and a second fluid pattern at a second dispense region with a second applicator. The first and second applicators are moved toward their respective dispense regions with a positioner. While dispensing, the second applicator is moved relative to the first applicator in a direction or directions parallel to a first axis, a second axis, and/or a third axis, the axes being mutually orthogonal. The first dispense region may be provided with a unique first tilt and/or a unique first contour relative to the reference plane and along the third axis. Systems for dispensing fluid include a primary positioner supporting a first applicator, and a secondary positioner coupled to the primary positioner and supporting a second applicator and configured to move the second applicator relative to the first applicator.

Abstract: Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.

Abstract: Methods for simultaneously dispensing a first fluid pattern at a first dispense region with a first applicator and a second fluid pattern at a second dispense region with a second applicator. The first and second applicators are moved toward their respective dispense regions with a positioner. While dispensing, the second applicator is moved relative to the first applicator in a direction or directions parallel to a first axis, a second axis, and/or a third axis, the axes being mutually orthogonal. The first dispense region may be provided with a unique first tilt and/or a unique first contour relative to the reference plane and along the third axis. Systems for dispensing fluid include a primary positioner supporting a first applicator, and a secondary positioner coupled to the primary positioner and supporting a second applicator and configured to move the second applicator relative to the first applicator.

Abstract: Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.

Abstract: Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.

Abstract: A computer controlled method for high speed viscous fluid dispensing includes the steps of providing a dot generator and moving the dot generator along at least X and Y axes. The dot generator is controlled to repeatedly eject jets of viscous fluid that break away from the dot generator as a result of their forward momentum and fly to the surface of an adjacent substrate to create dots. The method may further comprise the step of monitoring the size and location of the dots through a vision system. The method may further comprise the steps of assigning dot sizes to specific components based on user specifications or a component library. The method may further comprise the step of optimizing the dot placement paths by aligning the in-line points of dot formation.

Abstract: A computer controlled system for high speed surface mount adhesive placement in circuit board production includes a dot generator supported for motion along the X, Y and Z axes. The dot generator ejects a jet of viscous adhesive that breaks away from the nozzle of the dot generator as a result of its own forward momentum. The system includes an automatic circuit board conveyor with adjustable width and pneumatically operated lift and lock mechanisms. The system runs through a self-diagnostic set-up procedure and dot calibration routine. Dot size and location are monitored through a video camera and vision circuit. A computer interfaces with the vision circuit and with motion, dot generator and conveyor controllers so that the system can operate in a high volume production assembly line. Application programs are executed by the system computer typically utilizing CAD data from a disk or a computer integrated manufacturing (CIM) controller.

Abstract: A method is provided for dispensing viscous materials which first requires the step of providing a dispensing device for holding a quantity of a viscous material to be dispensed through a tip thereof. Next, the dispensing device is coupled to a dispensing control so that a metered amount of viscous material will be dispensed in response to a dispensing control signal. Next, the dispensing device is moved along an axis to selectively position the tip a predetermined distance away from the surface of a workpiece positioned adjacent thereto in response to an applied height control signal. The height control signal is generated by processing output signals from a camera which is moved along the axis with the dispensing device to determine when an image of the workpiece surface is maximally in focus.

Abstract: A syringe or other suitable dispensing device is coupled to conventional controls for dispensing viscous material such as adhesives or solder paste through a tip thereof. The syringe is supported on a motor driven carriage for movement along a Z axis in response to height control signals. A camera also mounted on the carriage generates output signals representative of an image of the surface of a workpiece such as a PC board. Circuity processes the output signals from the camera to determine when the image is maximally in focus and generates the height control signals necessary to maintain the tip of the syringe a predetermined constant height above the surface of PC board. This ensures the dispensing of uniform balls of solder paste or adhesive at various locations on the PC board despite warpage in the board.

Abstract: A syringe or any other dispensing device is coupled to a conventional dispensing control unit for dispensing viscous material such as adhesives and solder paste through a hollow needle thereof as metered amounts of pressurized gas are supplied to the syringe in response to a valve control signal applied to the dispensing control unit. The syringe is mounted on an automated frame for independent movement along the X, Y and Z axes in response to drive signals. Predetermined pattern and fluid flow functions are selected for each of a plurality of consecutive movement elements by operator actuation of corresponding discrete manually actuable switches to thereby create a workpiece program which can be automatically executed on command to dispense the viscous material over the upper surface of a workpiece such as a PC board in the prescribed manner.