Patents by Inventor Philip R. Osborn
Philip R. Osborn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140124565Abstract: First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip contact or one or more substrate contacts. A third bond element can be joined to ends of the first and second bond elements. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.Type: ApplicationFiled: January 14, 2014Publication date: May 8, 2014Applicant: Tessera, Inc.Inventors: Belgacem Haba, Philip Damberg, Philip R. Osborn
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Publication number: 20140021641Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.Type: ApplicationFiled: September 23, 2013Publication date: January 23, 2014Applicant: TESSERA, INC.Inventors: Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R. Osborn
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Patent number: 8618659Abstract: A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.Type: GrantFiled: May 2, 2012Date of Patent: December 31, 2013Assignee: Tessera, Inc.Inventors: Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi
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Patent number: 8541873Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.Type: GrantFiled: August 8, 2011Date of Patent: September 24, 2013Assignee: Tessera, Inc.Inventors: Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R. Osborn
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Patent number: 8410618Abstract: A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts.Type: GrantFiled: August 2, 2011Date of Patent: April 2, 2013Assignee: Tessera, Inc.Inventors: Belgacem Haba, Philip Damberg, Philip R. Osborn
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Publication number: 20120280386Abstract: A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.Type: ApplicationFiled: May 2, 2012Publication date: November 8, 2012Applicant: TESSERA, INC.Inventors: Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi
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Publication number: 20110291297Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.Type: ApplicationFiled: August 8, 2011Publication date: December 1, 2011Applicant: TESSERA, INC.Inventors: Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R. Osborn
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Publication number: 20110285020Abstract: A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts.Type: ApplicationFiled: August 2, 2011Publication date: November 24, 2011Applicant: TESSERA RESEARCH LLCInventors: Belgacem Haba, Philip Damberg, Philip R. Osborn
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Patent number: 8008785Abstract: A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts.Type: GrantFiled: June 4, 2010Date of Patent: August 30, 2011Assignee: Tessera Research LLCInventors: Belgacem Haba, Philip Damberg, Philip R. Osborn
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Patent number: 7994622Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.Type: GrantFiled: April 16, 2008Date of Patent: August 9, 2011Assignee: Tessera, Inc.Inventors: Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R. Osborn
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Publication number: 20110147953Abstract: A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts.Type: ApplicationFiled: June 4, 2010Publication date: June 23, 2011Applicant: TESSERA RESEARCH LLCInventors: Belgacem Haba, Philip Damberg, Philip R. Osborn
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Publication number: 20110147928Abstract: Microelectronic assemblies can have multiple conductive bond elements, e.g., bond wires, or a lead bond and a bond wire, extending between a pair of a substrate contact and a chip contact. E.g., a first bond wire can have ends joined to the contacts of the chip and substrate. A second bond wire can be joined to the ends of the first bond wire so that the second bond wire does not touch either the chip contact or the substrate contact to which the first bond wire is joined. In one example, a bond wire has a looped connection with first and second ends joined at a first contact and a middle portion joined to a second contact. In one example, first and second bond elements, e.g., bond wires or lead bonds can connect first and second pairs of a substrate contact with a chip contact. A third bond element, e.g., a bond wire or bond ribbon, can be joined to ends of the first and second bond elements.Type: ApplicationFiled: December 22, 2009Publication date: June 23, 2011Applicant: TESSERA RESEARCH LLCInventors: Belgacem Haba, Philip Damberg, Philip R. Osborn
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Publication number: 20080303132Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.Type: ApplicationFiled: April 16, 2008Publication date: December 11, 2008Applicant: Tessera, Inc.Inventors: Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R. Osborn
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Publication number: 20080185705Abstract: A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.Type: ApplicationFiled: August 23, 2007Publication date: August 7, 2008Applicant: Tessera, Inc.Inventors: Philip R. Osborn, Belgacem Haba, Ellis Chau, Giles Humpston, Masud Beroz, Teck-Gyu Kang, Dat Nghe Duong, Jae M. Park, Jesse Burl Thompson, Richard Dewitt Crisp
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Patent number: 7268304Abstract: A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.Type: GrantFiled: April 21, 2005Date of Patent: September 11, 2007Assignee: Tessera, Inc.Inventors: Masud Beroz, Jae M. Park, Belgacem Haba, Fion Tan, Philip R. Osborn