Patents by Inventor Philip S. Hedges

Philip S. Hedges has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacture of printed circuit board assemblies
    Patent number: 4960236
    Abstract: To avoid the use of harmful CFCs in the cleaning of soldered printed circuit board assemblies, their manufacture is accomplished using a screen-printable solder paste composition which will in use yield minimal flux residues which will not require removal by a solvent cleaning step. The paste composition is formulated by incorporating the powdered soft solder alloy in a liquid medium containing up to 10% by weight of a non-corrosive organic flux material, a substantially water-immiscible organic solvent, and one or more thickening agents.
    Type: Grant
    Filed: August 14, 1989
    Date of Patent: October 2, 1990
    Assignee: Multicore Solders Limited
    Inventors: Philip S. Hedges, Wallace Rubin