Patents by Inventor Philip Seitzer

Philip Seitzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of electrical testing
    Publication number: 20070024303
    Abstract: A method of electrical testing devices such as integrated circuits that include conductive pads formed on the surface. A material having a desired bulk resistivity and viscosity is applied to either the device or the electrical probe prior to testing. The application of the material has been found to substantially reduce the need for cleaning of the probe.
    Type: Application
    Filed: September 29, 2006
    Publication date: February 1, 2007
    Inventors: James Golden, Wayne Rademacher, Calvin Schumacher, Philip Seitzer, Steven Stang
  • Reinforced bond pad for a semiconductor device
    Publication number: 20060226535
    Abstract: Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.
    Type: Application
    Filed: June 7, 2006
    Publication date: October 12, 2006
    Inventors: Joze Antol, Philip Seitzer, Daniel Chesire, Rafe Mengel, Vance Archer, Thomas Gans, Taeho Kook, Sailesh Merchant
  • Reinforced bond pad for a semiconductor device
    Publication number: 20060065969
    Abstract: Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventors: Joze Antol, Philip Seitzer, Daniel Chesire, Rafe Mengel, Vance Archer, Thomas Gans, Taeho Kook, Sailesh Merchant
  • Method of electrical testing
    Publication number: 20060022689
    Abstract: A method of electrical testing devices such as integrated circuits that include conductive pads formed on the surface. A material having a desired bulk resistivity and viscosity is applied to either the device or the electrical probe prior to testing. The application of the material has been found to substantially reduce the need for cleaning of the probe.
    Type: Application
    Filed: May 26, 2005
    Publication date: February 2, 2006
    Inventors: James Golden, Wayne Rademacher, Calvin Schumacher, Philip Seitzer, Steven Stang