Patents by Inventor Philip Shek Wah Pang

Philip Shek Wah Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cryogenic devices
    Patent number: 6711912
    Abstract: This invention relates generally to cryogenic devices and, more particularly, to cryogenic devices of very small size based on superconducting elements, low thermal transmission interconnects and low dissipated power semiconductor.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: March 30, 2004
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Daniel B. Laubacher, Zhi-Yuan Shen, Philip Shek Wah Pang, Alan Lauder, Dean Face
  • Cryogenic devices
    Patent number: 6688127
    Abstract: This invention relates generally to cryogenic devices and, more particularly, to cryogenic devices of very small size based on superconducting elements, low thermal transmission interconnects and low dissipated power semiconductor
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: February 10, 2004
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Daniel B. Laubacher, Zhi-Yuan Shen, Philip Shek Wah Pang, Alan Lauder
  • Method for double-sided patterning of high temperature superconducting circuits
    Patent number: 6566146
    Abstract: In a process for patterning both sides of a double-sided HTS thin film wafer with the patterns in close registration, the first side is patterned with at least one reference mark and the second side is patterned with at least one aperture which permits alignment of the reference mark from the already applied pattern on the first side preferably to a similar reference mark on the yet to be applied patterns on the second side, such that the patterns can be aligned in close registration, using microcopic viewing techniques if necessary.
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: May 20, 2003
    Inventor: Philip Shek Wah Pang
  • Cryogenic devices
    Publication number: 20030024258
    Abstract: This invention relates generally to cryogenic devices and, more particularly, to cryogenic devices of very small size based on superconducting elements, low thermal transmission interconnects and low dissipated power semiconductor
    Type: Application
    Filed: July 2, 2002
    Publication date: February 6, 2003
    Inventors: Daniel B. Laubacher, Zhi-Yuan Shen, Philip Shek Wah Pang, Alan Lauder, Dean Face
  • Cryogenic devices
    Publication number: 20020178742
    Abstract: This invention relates generally to cryogenic devices and, more particularly, to cryogenic devices of very small size based on superconducting elements, low thermal transmission interconnects and low dissipated power semiconductor
    Type: Application
    Filed: July 2, 2002
    Publication date: December 5, 2002
    Inventors: Daniel B. Laubacher, Zhi-Yuan Shen, Philip Shek Wah Pang, Alan Lauder
  • Cryogenic devices
    Publication number: 20020053215
    Abstract: This invention relates generally to cryogenic devices and, more particularly, to cryogenic devices of very small size based on superconducting elements, low thermal transmission interconnects and low dissipated power semiconductor devices.
    Type: Application
    Filed: September 7, 2001
    Publication date: May 9, 2002
    Inventors: Daniel B. Laubacher, Zhi-Yuan Shen, Philip Shek Wah Pang, Alan Lauder
  • Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof
    Patent number: 5759625
    Abstract: Processes for patterning amorphous fluoropolymer Teflon.RTM.AF, passivating high temperature superconductor films, and improved electronic devices with amorphous fluoropolymer Teflon.RTM.AF films are disclosed.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: June 2, 1998
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Daniel Bruce Laubacher, Philip Shek Wah Pang
  • Method for improving the performance of high temperature superconducting thin film wafers
    Patent number: 5688383
    Abstract: A method for decreasing the microwave surface impedance of high-temperature superconducting thin films comprises (a) applying, preferably by spin-coating, a protective coating (preferably poly(methyl methacrylate) or polyimide) to the surface of a high-temperature superconducting thin film, such as Tl.sub.2 Ba.sub.2 CaCu.sub.2 O.sub.8 ; (b) exposing the coated thin film to low angle ion milling at an incident angle of 5.degree. to 30.degree. (preferably 10.degree. to 20.degree.) relative to the surface of the coated film; and (c) optionally including the step of removing any residual protective coating from the surface of the thin film, such as by exposure to an oxygen plasma.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: November 18, 1997
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Philip Shek Wah Pang