Abstract: Phenylhydrazine/anhydride adducts and anaerobic curable compositions using these adducts are provided. The compositions are particularly useful as adhesives and sealants.

Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Abstract: A process for preparing moisture curable compounds and moisture curable compositions prepared from the product of that process is provided.

Abstract: The present invention provides adhesive compositions, sometimes in a two part configuration which include a first part containing a (meth)acrylic component, an organic peroxide and a silsesquioxane and a second part containing a (meth)acrylic component, a nitrogen-containing compound and a metal salt.

Abstract: A process for preparing moisture curable compounds and moisture curable compositions prepared from the product of that process is provided.

Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Abstract: Cure accelerators for anaerobic curable compositions, such as adhesives and sealants, are provided, and which are defined with reference to the compounds shown in structure I where A is CH2 or benzyl, R is C1-10 alkyl, R? is H or C1-10 alkyl, or R and R? taken together may form a four to seven membered ring fused to the benzene ring, R? is optional, but when R? is present, R? is halogen, alkyl, alkenyl, cycloalkyl, hydroxyalkyl, hydroxyalkenyl, alkoxy, amino, alkylene- or alkenylene-ether, alkylene (meth)acrylate, carbonyl, carboxyl, nitroso, sulfonate, hydroxyl or haloalkyl, and EWG is as shown, an electron withdrawing group, such as nitro, nitrile, carboxylate or trihaloalkyl.

Abstract: Cure accelerators for anaerobic curable compositions, such as adhesives and sealants, are provided, and which are defined with reference to the aromatic amides shown in structure I where R and R? are each independently C1-10 alkyl, and R? is H or C1-10 alkyl or R and R? together may form a four to seven membered ring fused to the benzene ring, and where R?? is optional, but when R?? is present, R?? is halogen, alkyl, alkenyl, cycloalkyl, hydroxyalkyl, hydroxyalkenyl, alkoxy, amino, alkylene- or alkenylene-ether, alkylene (meth)acrylate, carbonyl, carboxyl, nitroso, sulfonate, hydroxyl or haloalkyl.

Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Abstract: Phenylhydrazine/anhydride adducts and anaerobic curable compositions using these adducts are provided. The compositions are particularly useful as adhesives and sealants.

Abstract: Cure accelerators for anaerobic curable compositions, such as adhesives and sealants, are provided, and which are defined with reference to the compounds shown in structure I where A is CH2 or benzyl, R is C1-10 alkyl, R? is H or C1-10 alkyl, or R and R? taken together may form a four to seven membered ring fused to the benzene ring, R? is optional, but when R? is present, R? is halogen, alkyl, alkenyl, cycloalkyl, hydroxyalkyl, hydroxyalkenyl, alkoxy, amino, alkylene- or alkenylene-ether, alkylene (meth)acrylate, carbonyl, carboxyl, nitroso, sulfonate, hydroxyl or haloalkyl, and EWG is as shown, an electron withdrawing group, such as nitro, nitrile, carboxylate or trihaloalkyl.

Abstract: Cure accelerators for anaerobic curable compositions, such as adhesives and sealants, are provided, and which are defined with reference to the aromatic amides shown in structure I where R and R? are each independently C1-10 alkyl, and R? is H or C1-10 alkyl or R and R? together may form a four to seven membered ring fused to the benzene ring, and where R?? is optional, but when R?? is present, R?? is halogen, alkyl, alkenyl, cycloalkyl, hydroxyalkyl, hydroxyalkenyl, alkoxy, amino, alkylene- or alkenylene-ether, alkylene (meth)acrylate, carbonyl, carboxyl, nitroso, sulfonate, hydroxyl or haloalkyl.

Abstract: A process for preparing moisture curable compounds and moisture curable compositions prepared from the product of that process is provided.

Abstract: A process for preparing moisture curable compounds and moisture curable compositions prepared from the product of that process is provided.

Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Abstract: The present invention relates to multi-functional polymeric resin blends which have a defined average molecular weight distribution. Additionally each polymeric component of the blend has a polydispersity of from about 1.01 to about 2.50. The average functionality of the blend is from about 1.8 to about 4.0. More particularly, the present invention relates to poly(meth)acrylates having three or more functional groups. These highly functionalized resin blends are desirably prepared using controlled free radical polymerization techniques, such as single electron transfer living radical polymerization (SET-LRP) processes to produce a variety of blended resin systems which have tailored and enhanced properties.

Abstract: A process for preparing moisture curable compounds and moisture curable compositions prepared from the product of that process is provided.

Abstract: Provided is a complex of hydrogen peroxide and at least one compound represented by Formula I: wherein X is: —C(R3)3, —C?C(R3), —O(R3), —N(R3)2, or —S(R3); and R1, R2, and R3 are each independently selected from H, alkyl, alkenyl, alkynyl, aralkyl, aryl, heteroaryl heteroarylalkyl, heterocyclyl, and cycloalkyl, or R2 and an R3 are optionally taken together to form an alicyclic ring. Also provided are anaerobic cure systems and curable compositions employing the complexes described herein.

Abstract: Provided is a complex of hydrogen peroxide and at least one compound represented by Formula I: wherein X is: —C(R3)3, —C?C(R3), —O(R3), —N(R3)2, or —S(R3); and R1, R2, and R3 are each independently selected from H, alkyl, alkenyl, alkynyl, aralkyl, aryl, heteroaryl heteroarylalkyl, heterocyclyl, and cycloalkyl, or R2 and an R3 are optionally taken together to form an alicyclic ring. Also provided are anaerobic cure systems and curable compositions employing the complexes described herein.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.