Abstract: A method for ascertaining fluid pressure in a fluid supply network having ultrasound transducers includes emitting an ultrasound signal from at least one ultrasound transducer and measuring at least one ultrasound time of flight of the signal in the fluid along an ultrasound measurement path. The flow velocity or a quantity proportional thereto or throughput is determined from the time of flight. The fluid pressure is determined from the time of flight aided by a mathematical compensation relating to at least one influence selected from a length or length change of the measurement path or a time of flight component or change thereof along the measurement path lying in or not lying in the fluid, or a fastening or position of the ultrasound transducer relative to the measurement path or a change thereof or a latency of signal processing or a change thereof or a throughput or change thereof.

Abstract: A method is provided for operating an autonomous mobile green area maintenance robot. The green area maintenance robot has a maintenance tool, wherein a maintenance height of the maintenance tool is adjustable. The method monitors whether a criterion for being stuck is satisfied, wherein the criterion for being stuck is characteristic of a contact part of the maintenance tool of the green area maintenance robot being stuck, and increases the maintenance height if the criterion for being stuck is satisfied.

Abstract: A method for operating an ultrasonic fluid meter, preferably an ultrasonic water meter, in a fluid distribution network, includes using an ultrasonic transducer to generate an ultrasonic signal which passes through a measurement path, and determining a flow volume by using evaluation electronics on the basis of a transit time and/or a transit time difference of the ultrasonic signal. A hydraulic force change acting on the ultrasonic transducer through the fluid generates a voltage signal waveform on the ultrasonic transducer and the voltage signal waveform is tapped by the evaluation electronics. An ultrasonic fluid meter, preferably ultrasonic water meter, is also provided.

Abstract: An outdoor treatment system has an autonomous mobile outdoor treatment robot and a sensor and control device. The outdoor treatment robot has a chassis and a contact element. The chassis is designed to execute a travelling movement of the outdoor treatment robot in a direction of travel. The contact element is designed to execute an avoiding movement in an avoiding direction as a result of the travelling movement in the direction of travel and contact between an obstacle and a lower contact point below a height limit and to execute a detection movement in a detection direction as a result of the travelling movement in the direction of travel and contact between an obstacle and an upper contact point at or above the height limit and is mounted so that it can move with respect to the chassis, wherein the avoiding direction and the detection direction are different.

Abstract: A blade for a mowing unit for a lawnmower and/or a motor scythe is substantially parallelogram-shaped. The blade has a slot, wherein the slot is designed to receive a blade-holding element of the mowing unit such that the blade can rotate about the blade-holding element and move in translation relative to the blade-holding element for one cutting position of the blade defined by one end of the slot having one cutting orientation of the blade and another cutting position of the blade defined by another end of the slot having another cutting orientation of the blade. A line segment delimited by the ends of the slot does run non-parallel to sides of the parallelogram, and the parallelogram has an obtuse internal angle.

Abstract: A cutting mechanism for a lawnmower and/or a motor scythe has at least one tool device, a tool connecting device, and a securing device. The tool device is designed for cutting grass. The tool connecting device is designed for rotation around a cutting mechanism rotation axis of the cutting mechanism. The tool connecting device and the tool device are designed to form a positive connection to one another in order to secure the positively connected tool device against being released from the tool connecting device radially in a radial direction with respect to the cutting mechanism rotation axis. The securing device and the tool connecting device are designed to be at least partially adjustable relative to one another in, or counter to, an at least partial radial direction at least section-by-section between an enable position for enabling production and/or release of the positive connection and a securing position for securing the positive connection against release.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.