Patents by Inventor Philip Yu

Philip Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210013173
    Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Inventors: Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu
  • Patent number: 10790261
    Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: September 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu
  • Publication number: 20200286603
    Abstract: A method includes receiving voice data from a voice-enabled device associated with a user, the voice data indicating a request for an output, determining from the voice data a current mood and/or cognitive state of the user, determining an output in response to the request, and adjusting the output and/or the form of the output according to the determined current mood and/or cognitive state of the user.
    Type: Application
    Filed: September 25, 2018
    Publication date: September 10, 2020
    Inventors: Olusola Ajilore, Alex Leow, Philip Yu, Ben Gerber, Faraz Hussain, Jun Ma
  • Publication number: 20200152616
    Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. A plurality of conductive bumps of a first package is attached to a tape carrier. A second package is coupled to the first package opposite to the plurality of conductive bumps. When coupling the second package, the plurality of conductive bumps are deformed to form a plurality of deformed conductive bumps, and a contact area between the tape carrier and the respective deformed conductive bump increases.
    Type: Application
    Filed: January 12, 2020
    Publication date: May 14, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai, Chia-Lun Chang, Chih-Chiang Tsao, Philip Yu-Shuan Chung
  • Patent number: 10544613
    Abstract: This invention is about an improved garage door opener system, with design features for preventing garage door break-in from outside of the garage using an object such as a hanger. Typically, a person pulls down a cord connected to a release handle to release emergency release of a garage door opener, allowing the door to be manually open or closed. An unauthorized person may attempt to pull down the cord using a hanger from outside the garage or to pull or push down the release handle, to open the door from outside and gain unauthorized entrance. The improved garage door opener system provides a mechanism to reverse the pulling direction of the cord and also protects release handle from being accessed from outside the garage, for increased security.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: January 28, 2020
    Inventors: Philip Yu Wing Tsui, Gallen Ka Leung Tsui
  • Patent number: 10535644
    Abstract: A manufacturing method of a package on package structure includes the following steps. A first package is provided on a tape carrier, wherein the first package includes an encapsulated semiconductor device, a first redistribution structure disposed on a first side of the encapsulated semiconductor device, and a plurality of conductive bumps disposed on the first redistribution structure and attached to the tape carrier. A second package is mounted on the first package through a plurality of electrical terminals by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps. Each of the deformed conductive bumps comprises a base portion connecting the first redistribution structure and a tip portion connecting the base portion, and a curvature of the base portion is substantially smaller than a curvature of the tip portion.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai, Chia-Lun Chang, Chih-Chiang Tsao, Philip Yu-shuan Chung
  • Publication number: 20200006308
    Abstract: A manufacturing method of a package on package structure includes the following steps. A first package is provided on a tape carrier, wherein the first package includes an encapsulated semiconductor device, a first redistribution structure disposed on a first side of the encapsulated semiconductor device, and a plurality of conductive bumps disposed on the first redistribution structure and attached to the tape carrier. A second package is mounted on the first package through a plurality of electrical terminals by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps. Each of the deformed conductive bumps comprises a base portion connecting the first redistribution structure and a tip portion connecting the base portion, and a curvature of the base portion is substantially smaller than a curvature of the tip portion.
    Type: Application
    Filed: August 9, 2018
    Publication date: January 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai, Chia-Lun Chang, Chih-Chiang Tsao, Philip Yu-shuan Chung
  • Publication number: 20190296002
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Application
    Filed: October 1, 2018
    Publication date: September 26, 2019
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20190279958
    Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
    Type: Application
    Filed: September 5, 2018
    Publication date: September 12, 2019
    Inventors: Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu
  • Publication number: 20180223580
    Abstract: This invention is about an improved garage door opener system, with design features for preventing garage door break-in from outside of the garage using an object such as a hanger. Typically, a person pulls down a cord connected to a release handle to release emergency release of a garage door opener, allowing the door to be manually open or closed. An unauthorized person may attempt to pull down the cord using a hanger from outside the garage or to pull or push down the release handle, to open the door from outside and gain unauthorized entrance. The improved garage door opener system provides a mechanism to reverse the pulling direction of the cord and also protects release handle from being accessed from outside the garage, for increased security.
    Type: Application
    Filed: February 9, 2018
    Publication date: August 9, 2018
    Inventors: Philip Yu Wing TSUI, Gallen Ka Leung TSUI
  • Patent number: 9618929
    Abstract: An inventory tracking system and method for use in semiconductor manufacturing provide for generating a priority score that determines the order in which lots of substrates should be run. The priority score is generated using an algorithm that takes into account external lot priority considerations, inventory factors in the manufacturing facility, and processing tool capability factors. The processing tool capability factors include factors related to tool status and tool restrictions and the inventory factors include factors related to line balance, WIP (work-in-progress) forecasts and various downstream considerations. The priority score is generated dynamically and displayed at each processing operation for each lot that is queued for processing at the indicated operation. Various algorithms are used and different weights are assigned to many factors in calculating numerical values for several factors that combine to produce the priority score.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: April 11, 2017
    Assignee: WAFERTECH, LLC
    Inventors: Masreth Siddiqui, Philip Yu, Maria Gonchoroff, Robert Hood, Andy Brogan, Philip Hunter
  • Publication number: 20160147219
    Abstract: An inventory tracking system and method for use in semiconductor manufacturing provide for generating a priority score that determines the order in which lots of substrates should be run. The priority score is generated using an algorithm that takes into account external lot priority considerations, inventory factors in the manufacturing facility, and processing tool capability factors. The processing tool capability factors include factors related to tool status and tool restrictions and the inventory factors include factors related to line balance, WIP (work-in-progress) forecasts and various downstream considerations. The priority score is generated dynamically and displayed at each processing operation for each lot that is queued for processing at the indicated operation. Various algorithms are used and different weights are assigned to many factors in calculating numerical values for several factors that combine to produce the priority score.
    Type: Application
    Filed: November 26, 2014
    Publication date: May 26, 2016
    Inventors: Masreth SIDDIQUI, Philip YU, Maria GONCHOROFF, Robert HOOD, Andy BROGAN, Philip HUNTER
  • Patent number: 9343990
    Abstract: The invention provides a low current consumption control switch device and method related thereto. The control switch device includes a switch control component, a microprocessor, a wireless signal receiver for receiving control signal and a DC power supply. The DC power supply draws an AC current from the AC power supply to power the wireless signal receiver, the microprocessor and the switch control component. The switch control component has a control input for receiving control instructions to control current supply from the AC power supply. The microprocessor is operatively connected to the switch control component for providing control instructions to alter its switching state. The control signal comprises a preamble and a message portion. The wireless signal receiver is configured to alternate between at least two current consumption modes and to remain in a higher current consumption mode upon detection of the preamble.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: May 17, 2016
    Inventors: Philip Yu Wing Tsui, Gallen Ka Leung Tsui
  • Patent number: 8976002
    Abstract: A universal remote control system is disclosed. The universal remote control includes a receiver that has a wireless signal receiver unit, an electric motor that drives a mechanical arm and a microprocessor. When the receiver receives a control signal from a wireless signal transmitter, the microprocessor will energize the motor which drives the mechanical arm toward a pushbutton switch of a controlled device, such as a garage door opener, and depresses the push button, therefore activating the garage door opener. A feedback signal, for example, from the mechanical arm or the motor, may be provided to the microprocessor to inform the microprocessor when the pushbutton switch is sufficiently depressed and is in an engaged state. When the switch is in the engaged state, the motor will reverse its direction, causing the mechanical arm to raise and move back to a standby position.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: March 10, 2015
    Inventors: Philip Yu Wing Tsui, Gallen Ka Leung Tsui
  • Publication number: 20140055234
    Abstract: A universal remote control system is disclosed. The universal remote control includes a receiver that has a wireless signal receiver unit, an electric motor that drives a mechanical arm and a microprocessor. When the receiver receives a control signal from a wireless signal transmitter, the microprocessor will energize the motor which drives the mechanical arm toward a pushbutton switch of a controlled device, such as a garage door opener, and depresses the push button, therefore activating the garage door opener. A feedback signal, for example, from the mechanical arm or the motor, may be provided to the microprocessor to inform the microprocessor when the pushbutton switch is sufficiently depressed and is in an engaged state. When the switch is in the engaged state, the motor will reverse its direction, causing the mechanical arm to raise and move back to a standby position.
    Type: Application
    Filed: August 20, 2013
    Publication date: February 27, 2014
    Inventors: Philip Yu Wing TSUI, Gallen Ka Leung TSUI
  • Publication number: 20120063186
    Abstract: The invention provides a low current consumption control switch device and method related thereto. The control switch device includes a switch control component, a microprocessor, a wireless signal receiver for receiving control signal and a DC power supply. The DC power supply draws an AC current from the AC power supply to power the wireless signal receiver, the microprocessor and the switch control component. The switch control component has a control input for receiving control instructions to control current supply from the AC power supply. The microprocessor is operatively connected to the switch control component for providing control instructions to alter its switching state. The control signal comprises a preamble and a message portion. The wireless signal receiver is configured to alternate between at least two current consumption modes and to remain in a higher current consumption mode upon detection of the preamble.
    Type: Application
    Filed: September 15, 2011
    Publication date: March 15, 2012
    Inventors: Philip Yu Wing TSUI, Gallen Ka Leung TSUI
  • Publication number: 20100116735
    Abstract: A method of monitoring and optionally controlling the biological activity in a boiler condensate and/or feedwater system is disclosed. The methodology involves looking at the amount of ATP in a boiler fluid.
    Type: Application
    Filed: November 13, 2008
    Publication date: May 13, 2010
    Inventors: F. Philip Yu, Deborah M. Bloom
  • Publication number: 20080104038
    Abstract: Techniques are provided for performing structural joins for answering containment queries. Such inventive techniques may be used to perform efficient structural joins of two interval lists which are neither sorted nor pre-indexed. For example, in an illustrative aspect of the invention, a technique for performing structural joins of two element sets of a tree-structured document, wherein one of the two element sets is an ancestor element set and the other of the two element sets is a descendant element set, and further wherein each element is represented as an interval representing a start position and an end position of the element in the document, comprises the following steps/operations. An index is dynamically built for the ancestor element set. Then, one or more structural joins are performed by searching the index with the interval start position of each element in the descendant element set.
    Type: Application
    Filed: December 28, 2007
    Publication date: May 1, 2008
    Applicant: International Business Machines Corporation
    Inventors: Shyh-Kwei Chen, Kun-Lung Wu, Philip Yu
  • Publication number: 20080052255
    Abstract: Most recent research of scalable inductive learning on very large streaming dataset focuses on eliminating memory constraints and reducing the number of sequential data scans. However, state-of-the-art algorithms still require multiple scans over the data set and use sophisticated control mechanisms and data structures. There is discussed herein a general inductive learning framework that scans the dataset exactly once. Then, there is proposed an extension based on Hoeffding's inequality that scans the dataset less than once. The proposed frameworks are applicable to a wide range of inductive learners.
    Type: Application
    Filed: October 31, 2007
    Publication date: February 28, 2008
    Applicant: International Business Machines Corporation
    Inventors: Wei Fan, Haixun Wang, Philip Yu
  • Publication number: 20080005744
    Abstract: The present invention relates to the problem of scheduling work for employees and/or other resources in a help desk or similar environment. The employees have different levels of training and availabilities. The jobs, which occur as a result of dynamically occurring events, consist of multiple tasks ordered by chain precedence. Each job and/or task carries with it a penalty which is a step function of the time taken to complete it, the deadlines and penalties having been negotiated as part of one or more service level agreement contracts. The goal is to minimize the total amount of penalties paid. The invention consists of a pair of heuristic schemes for this difficult scheduling problem, one greedy and one randomized. The greedy scheme is used to provide a quick initial solution, while the greedy and randomized schemes are combined in order to think more deeply about particular problem instances.
    Type: Application
    Filed: June 25, 2007
    Publication date: January 3, 2008
    Inventors: Melissa Buco, Rong Chang, Laura Luna, Christopher Ward, Joel Wolf, Philip Yu