Patents by Inventor Philipp Holler

Philipp Holler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a plate arrangement
    Patent number: 12074001
    Abstract: The invention relates to a method of producing a plate arrangement comprising two plates (1, 2) which, at least in sections, have an intermediate space (4) located between them and a constant distance (d) to one another and/or are arranged parallel to one another and between which a fusible solder material (3, 3?) is arranged. The task of setting a defined distance between the plates as accurately as possible is solved according to the invention by creating a pressure difference between the intermediate space (4) between the plates and the outer space surrounding the plates in such a way that the pressure in the outer space is higher than in the intermediate space (4) and that the temperature of the solder material (3, 3?) is at least temporarily raised above its melting temperature during the existence of the pressure difference.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: August 27, 2024
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Matthias Gremmelspacher, Rainer Kubler, Tobias Rist, Alexander Kott, Philipp Holler
  • METHOD FOR PRODUCING A PLATE ARRANGEMENT
    Publication number: 20220130620
    Abstract: The invention relates to a method of producing a plate arrangement comprising two plates (1, 2) which, at least in sections, have an intermediate space (4) located between them and a constant distance (d) to one another and/or are arranged parallel to one another and between which a fusible solder material (3, 3?) is arranged. The task of setting a defined distance between the plates as accurately as possible is solved according to the invention by creating a pressure difference between the intermediate space (4) between the plates and the outer space surrounding the plates in such a way that the pressure in the outer space is higher than in the intermediate space (4) and that the temperature of the solder material (3, 3?) is at least temporarily raised above its melting temperature during the existence of the pressure difference.
    Type: Application
    Filed: January 31, 2020
    Publication date: April 28, 2022
    Inventors: Matthias Gremmelspacher, Rainer Kubler, Tobias Rist, Alexander Kott, Philipp Holler