Patents by Inventor Philipp Hortmann

Philipp Hortmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip cooling device having wedge element
    Patent number: 8662155
    Abstract: The present invention relates to a cooling device improving the heat transfer between a chip (2) having a semiconducting substrate (3) and a heat sink (7). The gap between a surface (11) of the chip (2) to be cooled and a surface (12) of the heat sink (7), the width of which depends on production tolerances of the elements and soldered connections, is formed as a wedge shape by an angled lower surface (12) of the heat sink, in order to create a wedge-shaped gap. A wedge element (17) having the same wedge angle as the wedge-shaped gap is inserted into said gap exactly far enough that it makes flat contact with both the chip surface (11) to be cooled and the heat sink surface (12). Dimensional deviations are thus compensated for, the use of gap fillers is avoided, and the heat transfer from the heat source to the heat sink is improved.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: March 4, 2014
    Assignee: GE Intelligent Platforms Embedded Systems, Inc.
    Inventors: Klaus Weinmann, Philipp Hortmann