Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

Abstract: Aspects of the disclosure include a structure for thermal management of pluggable hardware modules, an optical transceiver, and a method of cooling a pluggable hardware module. One embodiment of the structure may comprise a socket assembly adapted to receive a hardware module. The socket assembly may comprise an integrated fluid reservoir containing a thermal interface material (TIM). The socket assembly may be further adapted to define a gap when the hardware module is plugged into the socket assembly. The structure may further comprise at least one dispensing port in fluid communication with the integrated fluid reservoir and the gap. The at least one dispensing port may be adapted to automatically distribute TIM from the integrated fluid reservoir into the gap when the hardware module is plugged into the socket assembly.

Abstract: Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

Abstract: Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.