Abstract: A method for molding a hardenable molding compound may comprise containing a hardenable molding compound in a cavity. The hardenable molding compound may be in a fluid state and the cavity may be delimited by a first mold part and at least one second mold part of a molding tool. After a defined period of time for heating the first mold part and the second mold part by the molding compound, the method may further comprise generating at least a first relative movement between the first mold part and the second mold part so that the cavity becomes smaller while forming one or more thin-walled regions. The one or more thin-walled regions having a material thickness of not more than 5 mm. The method may further comprise allowing the molding compound to harden.

Abstract: A data processing device having a housing in which are arranged a processor, a program memory connected to the processor and at least one hardware component connected to the processor via a data line and supplied with power via a power supply line, comprises a microcontroller arranged in the housing and having an interface and a persistent key memory in which the public key of a first public/private key pair is stored, wherein a switch controlled by the microcontroller is interposed in the data line, and wherein the microcontroller is configured to receive a signature, generated using the private key of the first key pair, of a memory module detachably connected to the interface via the interface, to verify the signature using the public key of the first key pair, and to switch on the switch in the case of verification.

Abstract: A data processing device having a housing in which are arranged a processor, a program memory connected to the processor and at least one hardware component connected to the processor via a data line and supplied with power via a power supply line, comprises a microcontroller arranged in the housing and having an interface and a persistent key memory in which the public key of a first public/private key pair is stored, wherein a switch controlled by the microcontroller is interposed in the data line, and wherein the microcontroller is configured to receive a signature, generated using the private key of the first key pair, of a memory module detachably connected to the interface via the interface, to verify the signature using the public key of the first key pair, and to switch on the switch in the case of verification.

Abstract: A method for additive manufacture of a plurality of motor vehicle components specifies a target geometry for the plurality of motor vehicle components, specifies a production geometry associated with a production position within a tool for additive manufacture according to the specified target geometry, and produces the plurality of motor vehicle components by additive manufacture according to the production geometry in the tool. An actual geometry of the plurality of motor vehicle components associated with a production position is determined, the actual geometry is compared with the target geometry, and the production geometry is adapted according to the comparison.