Abstract: In an embodiment an electronic device includes a housing body with a cavity in which an electronic semiconductor chip is mounted and a cover element arranged in the cavity and covering the semiconductor chip, wherein the cavity has a side wall, which faces the semiconductor chip, and which surrounds the semiconductor chip in a lateral direction, wherein the cover element is in direct mechanical contact with the side wall in at least one adhesion region and adheres directly to the housing body in the at least one adhesion region, wherein the housing body has at least one anchoring structure configured to reduce a delamination tendency of the cover element from the housing body in the at least one adhesion region, and wherein the anchoring structure comprises a roughening and/or at least one pillar element located on a bottom surface of the cavity.

Abstract: A laser device comprises a carrier, an optoelectronic component provided on the carrier, said component being designed to emit laser radiation, and an optical element designed to form the laser radiation emitted by the optoelectronic component, wherein: the optical element has a first layer that is at least partially transparent to the laser radiation, with a first refractive index, and a second layer that is at least partially transparent to the laser radiation, with a second refractive index; the first layer being applied to the optoelectronic component and having a surface with an imprinted structure; and the second layer is applied to the first layer, on the surface (24) having the imprinted structure.

Abstract: A laser device comprises a carrier, an optoelectronic component provided on the carrier, said component being designed to emit laser radiation, and an optical element designed to form the laser radiation emitted by the optoelectronic component, wherein: the optical element has a first layer that is at least partially transparent to the laser radiation, with a first refractive index, and a second layer that is at least partially transparent to the laser radiation, with a second refractive index; the first layer being applied to the optoelectronic component and having a surface with an imprinted structure; and the second layer is applied to the first layer, on the surface (24) having the imprinted structure.