Abstract: This disclosure relates to paper-based packaging films and methods of producing the same. The paper-based packaging films have a total composition comprising greater than or equal to 80%, by weight, of a paper component and less than or equal to 5%, by weight, of non-compostable materials. The paper-based packaging films are easily recyclable by repulping yet retain high-performance packaging characteristics including improved barrier performance and high run speed on packaging equipment.

Abstract: This disclosure concerns a multilayer packaging film having a first base layer, a second base layer on the first base layer, and a sealing layer on the second base layer. In some embodiments, a shrinkage value of the second base layer is less than a shrinkage value of the first base layer. In some embodiments, the shrinkage value of the second base layer is greater than or equal to a shrinkage value of the first base layer. In some embodiments, the second base layer has a shrinkage value that is greater than 5%, and the shrinkage value of the second base layer is less than a shrinkage value of the first base layer. Also disclosed are methods of producing multilayer packaging films and hermetically sealed packages (e.g., thermoformed trays or cups and retort pouches) formed from the multilayer packaging film.

Abstract: Film structures and methods of forming a film structure are described herein. The film structure includes a polymeric substrate having an inorganic coating thereon. The film structure has a polymeric buffer layer positioned between the polymeric substrate and the inorganic coating. The inorganic coating comprises a wave structure characterized by an average amplitude in a range of from 0.1 ?m to 5 ?m and a wavelength in a range of from 0.3 ?m to 15 ?m. The inventors have advantageously discovered that the wave structure of the inorganic coating exhibits improved optical properties (e.g., light refraction). The film structures described herein may be used in greenhouse screens.

Abstract: This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 ?m to 100 ?m, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude in the range of from 0.25 ?m to 1.0 ?m and a wavelength in the range of from 2 ?m to 5 ?m. Also disclosed are packages (e.g., hermetically sealed packages) formed from the barrier packaging film.

Abstract: A durable barrier film including a polymeric substrate layer having a thickness between (10) and (100) pm, an inorganic coating layer, and a polymeric buffer layer positioned between the polymeric substrate layer and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude between (0.25) and (1.0) pm and a wavelength between (2) and (5) pm.