Abstract: Various embodiments of the teachings herein include a power electronics assembly having a substrate with two loadable power modules. The two modules each comprise: a power substrate with a first metallization; a switchable die with power interfaces; an interposer; and two contact elements, each of which provides an electrical contact for one of the power interfaces at the interposer. The die is joined to the metallization of the power substrate and to the interposer. A gap is defined between the first substrate, the interposer, and the die, and closed off by an insulation material so the die is surrounded by the insulation material, the power substrate, and the interposer. At least one of the contact elements projects through the interposer and/or is part of the interposer.

Abstract: A circuit assembly includes first and second circuit carriers and a semiconductor component arranged between the circuit carriers and having first and second load terminals. The first load terminal has a first load terminal surface which faces the first circuit carrier and around which an electrically insulating edging structure is arranged. The second load terminal has a second load terminal surface which faces the second circuit carrier and is larger than the first load terminal surface. The first circuit carrier has a first through-contact which electrically connects the first load terminal surface to a first conductor path, which runs inside the first circuit carrier or on a top side of the first circuit carrier facing away from the semiconductor component. The second circuit carrier has a top side facing the semiconductor component and formed by a first electrically conductive layer that is electrically connected to the second load terminal surface.

Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.

Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.

Abstract: A film capacitor includes first and second contact layers and a metallized dielectric film with first and second end faces and with first and second film sides. The first end face of the metallized dielectric film is connected to the first contact layer and the second end face is connected to the second contact layer. The metallized dielectric film has first, second and third metallization layers, with at least two of the metallization layers applied on the first film side of the metallized dielectric film and at least a further of the metallization layers applied on the second film side. The metallization layers are arranged on the film sides in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the metallization layers on the film sides, with the partial capacitances forming a series connection.

Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.

Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier. The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.

Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier, The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.

Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.