Abstract: The disclosure concerns a flying-capacitor inverter, comprising a switch leg with four switches, a flying capacitor connected to the switch leg, an output between pairs of the switches, and a control device connected to each of the four switches, wherein the control device is configured to employ phase-shift modulation to switch the four switches such that switching signals for a first switch and a fourth switch of the four switches are phase shifted to the switching signals for a second switch and a third switch of the four switches. The disclosure also concerns a multi-level phase-shift converter comprising the flying-capacitor inverter, as well as a method for controlling the flying-capacitor inverter and/or the multi-level phase-shift converter.

Abstract: The disclosure concerns a full-bridge converter (1) that is capable to provide different operation and transition modes that lead to reduced losses and stressing of the components of the full-bridge converter (1). This is achieved by a clamping circuit and applying specific switching patterns to the transistors (S1, S2, S3, S4) of a full bridge of the full-bridge converter (1).

Abstract: The disclosure concerns a converter component, especially for LLC resonant converters, comprising a magnetic core with at least three legs, at least one first electrical winding, and at least one second electrical winding. Therein, the second 5 electrical winding is wound so as to at least once and at least partially surround at least a first leg and a second leg of the at least three legs of the magnetic core. The disclosure also concerns a converter comprising the converter component.

Abstract: An interleaved LLC converter arrangement includes two or more LLC converters for transferring power from an input side to an output side, wherein the two or more LLC converters include a first LLC converter and a second LLC converter connected in parallel on the input side and on the output side and wherein each LLC converter includes a bridge inverter at the input side. For balancing the power transfer among the LLC converters if for example the second LLC converter transfers more power from the input side to the output side than the first LLC converter, each leg of the bridge of the bridge inverter of the first LLC converter is operated with a duty cycle of 0.5 and at least one leg of the bridge of the bridge inverter of the second LLC converter is operated with a duty cycle different from 0.5.

Abstract: Full bridge converter-circuit having a H-bridge, comprising a control circuit for operating the H-bridge in a first operation mode or a second operation mode, wherein the control circuit is configured that between switching from the first operation mode to the second operation mode a morphing operation mode is applied in which a positive inverter voltage pulse length on a first half-bridge of the H-bridge is determined on the basis of a negative inverter voltage pulse length on a second half-bridge of the H-bridge.

Abstract: In order to balance the thermal stress of the switches (S1-S4) of the two legs of an inverter full bridge (4), the driving signals are generated using an up-down counter having a modulation period Tmod of twice the period T of the input voltage (Vin). The up-down counter has a first compare value (41) of D/4 and a second compare value (42) of (2+D)/4, where D is the duty cycle and where the second half bridge is phase shifted by the period T.

Abstract: A power converter-circuit (100) having a transformer (T), comprising a snubber-circuit (Csn, DSn,S3, S3, DSn,S4) for suppressing voltage peaks on a secondary side of the transformer (T) that comprises a snubber capacitor (Csn); and an auxiliary DC-DC converter (101) having a first input connected with the snubber capacitor (Csn) and a first output connected with a first output (VOut) of the power converter-circuit (100). This circuit increases efficiency of electrical conversion and reduces thermal losses.

Abstract: The invention relates to a resonator of a wireless power transfer system (1), including a magnetic core in the form of an H-core with two yokes and at least one limb (52) connecting the yokes where a winding (53) is wound on the limb (52) of the core. The winding (53) includes a PCB (56.1) on one side of the limb (52) and a PCB (56.2) on another side of the limb (52) where the turns of the coil are formed by traces on the first PCB (56.1) and on the second PCB (56.2) that are connected to each other by soldering pins (57) that are soldered into corresponding holes of the PCBs (56.1, 56.2). The traces on the PCBs (56.1, 56.2) may be provided on a single conductive layer of the PCBs (56.1, 56.2) or the PCBs may be multilayer PBS, where each turn section between two soldering pins (57) on one of the PCBs (56.1, 56.2) may include several strands including one or more traces on one or more conductive layers.

Abstract: An interleaved LLC converter arrangement includes two or more LLC converters for transferring power from an input side to an output side, wherein the two or more LLC converters include a first LLC converter and a second LLC converter connected in parallel on the input side and on the output side and wherein each LLC converter includes a bridge inverter at the input side. For balancing the power transfer among the LLC converters if for example the second LLC converter transfers more power from the input side to the output side than the first LLC converter, each leg of the bridge of the bridge inverter of the first LLC converter is operated with a duty cycle of 0.5 and at least one leg of the bridge of the bridge inverter of the second LLC converter is operated with a duty cycle different from 0.5.

Abstract: The invention relates to a resonator of a wireless power transfer system (1), including a magnetic core in the form of an H-core with two yokes and at least one limb (52) connecting the yokes where a winding (53) is wound on the limb (52) of the core. The winding (53) includes a PCB (56.1) on one side of the limb (52) and a PCB (56.2) on another side of the limb (52) where the turns of the coil are formed by traces on the first PCB (56.1) and on the second PCB (56.2) that are connected to each other by soldering pins (57) that are soldered into corresponding holes of the PCBs (56.1, 56.2). The traces on the PCBs (56.1, 56.2) may be provided on a single conductive layer of the PCBs (56.1, 56.2) or the PCBs may be multilayer PBS, where each turn section between two soldering pins (57) on one of the PCBs (56.1, 56.2) may include several strands including one or more traces on one or more conductive layers.