Abstract: The disclosure relates to a semiconductor die, comprising a silicon carbide (SiC) semiconductor body; a passivation system on a first side of the SiC semiconductor body ; the passivation system comprising an inorganic passivation layer system and an organic layer on the inorganic passivation layer system, a lateral edge of the inorganic passivation layer system arranged on the SiC semiconductor body, wherein the inorganic passivation layer system is laterally set back under the organic layer, the lateral edge of the inorganic passivation layer system being covered by the organic layer.

Abstract: The disclosure relates to a semiconductor die, comprising a silicon carbide (SiC) semiconductor body in which a device structure with a load terminal is formed; a metallization on a first side of the SiC semiconductor body, in which a load pad is formed; a passivation system on the metallization, which has an opening on the load pad; wherein the passivation system, as viewed in a sectional plane perpendicular to a lateral edge of the load pad, extends between an outer lateral position x1 aside the load pad and an inner lateral position x2 on the load pad, wherein an interruption is provided in at least one layer of the passivation system at an interruption position xi between the lateral edge of the load pad and the inner lateral position x2.

Abstract: A method for determining at least one operation to be performed by at least one robot for machining at least one component is provided. An electronic computing device determines product data which characterizes the at least one component. The electronic computing device determines system data which characterizes a system including the robot for performing the at least one operation. The electronic computing device generates a simulation model that simulates the system and the at least one component based on the product data and the system data. The electronic computing device performs a simulation by way of the simulation model, as a result of which the electronic computing device determines process data describing multiple step groups, each of the step groups comprising multiple sub-steps of the at least one operation which differ from one another.

Abstract: The present application relates to a semiconductor die, comprising a silicon carbide (SiC) semiconductor body comprising a first doping type region; a metallization on a first side of the SiC semiconductor body; an inorganic passivation layer system; a lateral edge of the inorganic passivation layer system arranged on the SiC semiconductor body, wherein the lateral edge of the inorganic passivation layer system is laterally offset inwards from a lateral edge of the SiC semiconductor body, the SiC semiconductor body being uncovered by the inorganic passivation layer system in an edge area, wherein a second doping type well is formed at the first side of the SiC semiconductor body in the first doping type region, the second doping type well extending from below the inorganic passivation layer system into the edge area.

Abstract: The disclosure concerns a magnetometer for detecting a magnetic field, comprising: a solid state electronic spin system containing a plurality of electronic spins and a solid carrier, wherein the electronic spins are configured to be capable of aligning with an external magnetic field in response to an alignment stimulus; and a detector configured to detect an alignment response of the electronic spins, such that the external magnetic field can be detected; wherein the electronic spins are provided as one or more groups, each group containing a plurality of spins, the plurality of spins in each of the one or more groups being arranged in a line that is angled at an angle ? with respect to the local direction of the external magnetic field at the said group. Also disclosed is a method for detecting a magnetic field.

Abstract: The disclosure concerns a magnetometer for detecting a magnetic field, comprising: a solid state electronic spin system containing a plurality of electronic spins and a solid carrier, wherein the electronic spins are configured to be capable of aligning with an external magnetic field in response to an alignment stimulus; and a detector configured to detect an alignment response of the electronic spins, such that the external magnetic field can be detected; wherein the electronic spins are provided as one or more groups, each group containing a plurality of spins, the plurality of spins in each of the one or more groups being arranged in a line that is angled at an angle ? with respect to the local direction of the external magnetic field at the said group. Also disclosed is a method for detecting a magnetic field.