Abstract: Various embodiments may relate to an optoelectronic component, including a carrier, a planar, electrically active region on or above the carrier; an adhesion layer on or above the electrically active region, wherein the adhesion layer at least partly surrounds the electrically active region, a cover on or above the adhesion layer, wherein a part of the adhesion layer is exposed, and an encapsulation on or above the exposed adhesion layer, wherein the encapsulation is formed from an inorganic substance or substance mixture. Further various embodiments may relate to a method for producing an optoelectronic component.

Abstract: An apparatus may include a first support covered with at least one ALD precursor and/or at least one MLD precursor, and a second support covered with at least one ALD precursor and/or at least one MLD precursor which is/are complementary to the ALD precursor and/or MLD precursor of the first support. The first support is at least partly joined to the second support by an atomic bond between the ALD precursor of the first support and the ALD precursor of the second support or between the MLD precursor of the first support and the MLD precursor of the second support in such a way that an ALD layer or an MLD layer is formed.

Abstract: An optoelectronic component may include a carrier, above which a first electrode is formed. An optically functional layer structure is formed above the first electrode. A second electrode is formed above the optically functional layer structure, the second electrode extending areally over at least one part of the side of the optically functional layer structure which faces away from the carrier. An encapsulation is formed above the first and/or second electrode, the encapsulation encapsulating the optically functional layer structure. An electrically conductive contact structure is arranged in a cutout of the encapsulation on the first and/or second electrode and extends through the encapsulation, for electrically contacting the first and/or second electrode. The contact structure and the encapsulation are formed such that in interaction they encapsulate the first and/or second electrode.

Abstract: In at least one embodiment, an organic optoelectronic component, which is preferably an organic light emitting diode, includes a first electrode layer, a second electrode layer and an organic layer sequence situated between the electrode layers. Furthermore, the component includes a light-transmissive current confinement layer, which is fitted over the whole area between the first electrode layer and the organic layer sequence, such that the organic layer sequence is spaced apart from the first electrode layer. The current confinement layer is produced continuously from a common starting material and is structured by treatment and/or by action of temperature into at least one conductive region having a high electrical conductivity and into at least one insulating region having a low electrical conductivity. These electrical conductivities differ from one another by at least a factor of 10.

Abstract: A method for producing an optoelectronic arrangement and an optoelectronic arrangement. In an embodiment the method includes providing a connection carrier having a contact surface and two connection points, which are electrically conductively connected with the contact surface, providing an optoelectronic device having a connection surface, introducing an electrically conductive bonding material between the contact surface of the connection carrier and the connection surface of the optoelectronic device and heating the contact surface of the connection carrier by energizing the contact surface via the two connection points, wherein the electrically conductive bonding material is heated by the contact surface such that the bonding material melts or hardens.

Abstract: A light-emitting organic component is specified, comprising—an organic active region (3), in which light is generated during the operation of the component, and—an uneven light exit surface (6), through which at least part of the light generated in the organic active region (3) emerges from the component, wherein—a multiplicity of optical structures (7) which optically influence the light passing through and/or impinging on them are arranged at the uneven light exit surface (6).

Abstract: An optoelectronic component and a method to operate the optoelectronic component are disclosed. In an embodiment the optoelectronic component includes an organic light-emitting diode configured to emit radiation through a main emission surface and a liquid crystal element configured to adjust a colour location of the radiation, wherein the liquid crystal element is switchable into a first state and into a second state, wherein the liquid crystal element in the first state is suitable for selectively reflecting light of a first wavelength range and in the second state is transparent, and wherein the liquid crystal element is arranged on a rear side of the organic light-emitting diode facing the main emission surface so that light of the first wavelength range that is emitted towards the rear side is at least partially reflected in a direction of the main emission surface in the first state of the liquid crystal element.

Abstract: The invention relates to an electronic component (1) with a substrate (2), on which an organic electronic functional area (3) is arranged, and a cover (4) which extends over the electronic functional area. Said cover is connected to the substrate by means of an electrically conductive solder layer (5). The invention also relates to a method for producing an electronic component.

Abstract: Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.

Abstract: Various embodiments may relate to an electronic structure, including at least one organic layer, at least one metal growth layer grown onto the organic layer, and at least one metal layer grown on the metal growth layer. The at least one metal growth layer contains germanium. Various embodiments further relate to a method for producing the electronic structure.

Abstract: Various embodiments may relate to a method for working an apparatus having at least one electrical layer structure. The electrical layer structure includes a dielectric layer in physical contact with an electrically conductive layer and the electrical layer structure has a first electrical conductivity. The method may include forming an electrical connection to the dielectric layer of the electrical layer structure, and forming an electrical voltage profile at the electrical connection in such a way that a second electrical conductivity is formed; wherein the second electrical conductivity is greater than the first electrical conductivity. The electrical layer structure has the second electrical conductivity after the reduction of the electrical voltage profile.

Abstract: An optoelectronic component may include a carrier, an organic functional layer structure, which is embodied on or above a carrier and is designed for taking up and/or providing electromagnetic radiation, an antireflection/getter layer structure arranged in the beam path of the organic functional layer structure and including getter material having a lower mean refractive index than the mean refractive index of the organic functional layer structure, and an antireflection layer, wherein material of the antireflection layer is arranged in the beam path of the organic functional layer structure at least partly between the organic functional layer structure and the getter material, and wherein the material of the antireflection layer arranged between the organic functional layer structure and the getter material has a mean refractive index which is greater than the refractive index of the getter material and/or comprises at least one scattering additive material distributed in a matrix.

Abstract: An organic optoelectronic component may include at least one contact pad with a first electrical contact region and a second electrical contact region. The first electrical contact region and the second electrical contact region are electrically connected to the contact pad. The second electrical contact region is designed in such a way that it has a higher adhesion than the first electrical contact region in respect of a cohesive connection means with the contact pad. The contact pad is designed in such a way that the first electrical contact region is free of cohesive connection means.

Abstract: Various embodiments may relate to an optoelectronic component, including a carrier, a planar, electrically active region on or above the carrier; an adhesion layer on or above the electrically active region, wherein the adhesion layer at least partly surrounds the electrically active region, a cover on or above the adhesion layer, wherein a part of the adhesion layer is exposed, and an encapsulation on or above the exposed adhesion layer, wherein the encapsulation is formed from an inorganic substance or substance mixture. Further various embodiments may relate to a method for producing an optoelectronic component.

Abstract: An apparatus may include a first support covered with at least one ALD precursor and/or at least one MLD precursor, and a second support covered with at least one ALD precursor and/or at least one MLD precursor which is/are complementary to the ALD precursor and/or MLD precursor of the first support. The first support is at least partly joined to the second support by an atomic bond between the ALD precursor of the first support and the ALD precursor of the second support or between the MLD precursor of the first support and the MLD precursor of the second support in such a way that an ALD layer or an MLD layer is formed.

Abstract: Various embodiments may relate to a component, including a carrier, a first electrode on or over the carrier, an organic functional layer structure on or over the first electrode, a second electrode on or over the organic functional layer structure, and thin film encapsulation. The first electrode and the second electrode are configured in such a way that an electrical connection of the first electrode to the second electrode is established only through the organic functional layer structure. The first electrode and/or the second electrode is electrically coupled to the carrier. The thin-film encapsulation together with the carrier forms a structure which seals the organic functional layer structure as well as at least one electrode out of the first electrode and the second electrode hermetically against water and/or oxygen.

Abstract: A light-emitting organic component is specified, comprising—an organic active region (3), in which light is generated during the operation of the component, and—an uneven light exit surface (6), through which at least part of the light generated in the organic active region (3) emerges from the component, wherein—a multiplicity of optical structures (7) which optically influence the light passing through and/or impinging on them are arranged at the uneven light exit surface (6).