Abstract: Passivation of a hybrid microelectronic device is achieved by plasma polyization of hexamethyldisilazane on the device surface. A moisture impermeable thin film layer is deposited which protects the moisture sensitive components from corrosion. The layer is readily removable, however, in order to effect repairs to the device when necessary.

Abstract: A hermetically sealed electronic circuit package is formed by placing a preformed, uncured sealant between a circuitized ceramic substrate and a ceramic cover. The resultant assembly is placed in an oven which has been preheated to a temperature at least as great as the curing temperature of the sealant and the oven is then evacuated. Before the sealant reaches its melting temperature, the oven is backfilled with nitrogen and stabilized at atmospheric pressure. The assembly is maintained in the heated environment for a period of time sufficient to substantially cure the sealant. The resulting assembly may be opened to affect any repairs that may become necessary and then reassembled.